08/11/2015  Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

08/11/2015  Colossal magnetoresistance is a property with practical applications in a wide array of electronic tools including magnetic sensors and magnetic RAM. New research successfully used high-pressure conditions to induce colossal magnetoresistance for the first time in a pure sample of a compound called lanthanum manganite, LaMnO3.

08/11/2015  Worldwide silicon wafer area shipments increased during the second quarter 2015 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

08/10/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today it is hosting its first Foundry Technology Symposium at the Grand Hyatt in Shanghai, China, on September 22, 2015.

08/07/2015  ON Semiconductor Corporation today announced that Alan Campbell has joined its Board of Directors.

08/06/2015  Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

08/06/2015  Qualcomm Incorporated subsidiary, Qualcomm Atheros, Inc., today announced it entered into a definitive merger agreement to acquire Ikanos Communications, Inc., a high performance broadband networking semiconductor and software provider enabling both central office and home gateway solutions.

08/06/2015  Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

08/05/2015  SEMI Taiwan PV Committee announced the newly-elected vice chairs: Cafer Huang, general manager at Giga Solar Materials Corp., and Swean Lin, president at Green Energy Technology Inc.

08/05/2015  The consolidation will consist of closing its Ipoh, Malaysia wafering plant by the end of 2016, and relocating the associated capacity to other plant sites. The company does not expect its total capacity to change.

08/05/2015  Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

08/04/2015  Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

08/04/2015  Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

08/04/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

08/03/2015  ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

08/03/2015  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014.

08/03/2015  Yoke Khin Yap, a professor of physics at Michigan Technological University, has worked with a research team that created these digital switches by combining graphene and boron nitride nanotubes.

07/31/2015  According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

07/31/2015  ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received an order, worth approximately US$16M, for multiple etch and deposition systems from WIN Semiconductors Corp.

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.