07/22/2015  SEMI today announced the fourth annual European 3D Summit. Entitled ?European 3D Summit 2016: Above and Beyond TSV,? the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

07/22/2015  North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders worldwide in June 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the June EMDS Book-to-Bill Report published today by SEMI

07/21/2015  Solid State Technology today announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab.

07/21/2015  In the last decade, graphene has been intensively studied for its unique optical, mechanical, electrical and structural properties.

07/20/2015  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced that Analog Devices, Inc. has joined SRC’s hardware cybersecurity research program called Trustworthy and Secure Semiconductors and Systems (T3S).

07/16/2015  CH2M has seen many changes and trends in the semiconductor industry since the company was involved designing many of the industry’s first wafer fabs back in the 1980s.

07/16/2015  Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

07/16/2015  Imagine EUV lithography in high volume production. ASML has been working for years to make it happen.

07/15/2015  SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.

07/15/2015  Continued advances in the semiconductor will increasingly be enabled by materials technology, versus the scaling that has been commonplace over the last 50 years as defined by Moore’s Law.

07/15/2015  “Let no element on the periodic table go un-used!” That may well be the rallying cry of the semiconductor industry moving forward.

07/15/2015  TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

07/15/2015  CEA-Leti and EV Group launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the nano-patterning technology and spread its use for applications beyond semiconductors.

07/14/2015  Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

07/14/2015  Durcan accepted his award for leadership at the Global Care Environmental, Health, and Safety (EHS) Lunch today at SEMICON West 2015 in San Francisco, Calif.

07/14/2015  SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

07/14/2015  SEMI today announced that Stephen S. Schwartz, CEO of Brooks Automation, and Toshikazu Umatate, senior vice president and general manager of the Semiconductor Lithography Business at Nikon Corporation, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

07/14/2015  China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, in what analysts say would be the biggest Chinese takeover of a U.S. company.

07/14/2015  The used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.