10/10/2018  Cadence Design Systems, Inc. today announced that it has received four TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform (OIP) Ecosystem Forum.

10/10/2018  SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics automation solutions.

10/10/2018  Semiconductors play increasingly important control roles in automotive, industrial and safety critical applications. Quality and reliability are therefore of vital importance and so Presto Engineering has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is Europe’s largest independent semiconductor test facility.

10/09/2018  Mentor, a Siemens business, announced it has qualified complete solutions from its Calibre nmPlatform, Analog FastSPICE (AFS) Platform, Eldo Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) manufacturing processes.

10/09/2018  Technion, Israel’s technological institute, announced this week that Intel is collaborating with the institute on its new artificial intelligence (AI) research center.

10/09/2018  Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in today’s leading-edge semiconductor gigafabs.

10/05/2018  INFICON Inc., a supplier of vacuum instrumentation and process control software to the semiconductor manufacturing industry acquired all assets of Final Phase Systems (FPS) of Austin, Texas, USA.

10/05/2018  Engineers at The Australian National University (ANU) have invented a semiconductor with organic and inorganic materials that can convert electricity into light very efficiently, and it is thin and flexible enough to help make devices such as mobile phones bendable.

10/05/2018  To scale down a transistor below a 5nm node is one of the vital concerns for VLSI industry as there are various challenges due to the shrinking of components. Several researches are going on worldwide to overcome the challenges of future technology nodes. Among them, this article reviews the potential transistor structures and materials like Carbon Nano-tube FET, Gate-All-Around FET, and Compound Semiconductors as solutions to overcome the problems of scaling the existing silicon FinFET transistor below 5nm node.

10/04/2018  The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) today announced the release of the AP SUNY Process Design Kit v2.5a.

10/04/2018  A team of semiconductor researchers based in France has used a boron nitride separation layer to grow indium gallium nitride (InGaN) solar cells that were then lifted off their original sapphire substrate and placed onto a glass substrate.

10/04/2018  According to data compiled by Inkwood Research, the global semiconductor market is projected to grow at a CAGR of 7.67% during the forecast period from 2017 to 2024.

10/03/2018  ANSYS announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology.

10/03/2018  History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans.

10/03/2018  SMART Global Holdings, Inc., parent company of SMART Modular Technologies, Inc. announced the appointment of Bryan Ingram, Senior Vice President and General Manager of the Wireless Semiconductor Division of Broadcom Inc., to its board of directors and its Compensation Committee, effective October 2, 2018.

10/02/2018  HEIDENHAIN announces a new series of angle encoders called the ERP 1000 with the design criteria of exceptionally high resolution, high speed, and high contamination resistance.

10/02/2018  Process power and reactive gas subsystems for semiconductor manufacturing equipment have grown at a CAGR of 21% since 2013.

10/02/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

10/02/2018  Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact an exclusion process for the most recent tranche of tariffs on $200 billion in goods imported from China.

10/01/2018  AES will add ARM's gas purification technology to supplement and further expand its gas delivery equipment offerings.