Semiconductors

SEMICONDUCTORS ARTICLES



Industry visionaries to present at SEMICON Japan 2018 SuperTHEATER

10/01/2018  Visionary keynote speakers and industry luminaries will share insights on Smart technologies that are shaping the future at SEMICON Japan 2018, the largest and most influential exhibition in Japan for electronics manufacturing.

Micron and ATP to collaborate on DDR2 continuity program

10/01/2018  Recognizing the importance of obsolescence mitigation in embedded and industrial systems, two of the biggest names in advanced storage, memory and semiconductor technologies have teamed up to ensure the continuous supply of legacy DDR2 memory modules in the market.

A 'recipe book' that creates color centers in silicon carbide crystals

10/01/2018  Researchers are documenting the different temperature and proton dosages required to make defects that will further allow silicon carbide to be used for quantum technology.

SEMI Korea Members Day: Takeaways and tech trends as Korea leads in fab investment

09/28/2018  Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI.

Molex announces agreement to acquire Laird Connected Vehicle Solutions division

09/28/2018  Investment to enhance connected mobility solutions for automotive manufacturers building intelligent next-generation vehicles.

Imagination and GLOBALFOUNDRIES collaborate to deliver ultra-low-power connectivity solutions for IoT applications

09/28/2018  Imagination brings Ensigma Ultra-Low-Power Connectivity IP to GLOBALFOUNDRIES' 22FDX process.

Machine learning helps improving photonic applications

09/28/2018  Nanostructures can increase the sensitivity of optical sensors enormously - provided that the geometry meets certain conditions and matches the wavelength of the incident light. This is because the electromagnetic field of light can be greatly amplified or reduced by the local nanostructure. The HZB Young Investigator Group "Nano-SIPPE" headed by Prof. Christiane Becker is working to develop these kinds of nanostructures.

JCET Group appoints distinguished semiconductor industry executive Dr. Lee Choon Heung as CEO

09/28/2018  Dr. Lee brings to JCET a wealth of expertise and veteran leadership with 20 years of extensive semiconductor packaging and test experience.

Solving the burden of Bourdon tubes

09/27/2018  Mini diaphragm gauges offer a new alternative to Bourdon tubes.

Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

Canon Marketing Japan announces that it has signed an exclusive distribution agreement with ClassOne Technology Inc.

09/27/2018  Canon Marketing Japan Inc. has signed an exclusive distribution agreement in Japan with ClassOne Technology Inc. and it will start receiving orders for ECD tool Solstice in 2018.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

WIN Semiconductors Corp integrated GaAs technologies support 5G user equipment and network infrastructure

09/26/2018  WIN Semiconductors Corp., the world?'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.

China trade brings semiconductor executives to DC for the Fall Washington Forum

09/26/2018  Last week, more than a dozen senior semiconductor executives traveled to Washington, DC for the first-ever Fall Washington Forum.

GLOBALFOUNDRIES delivering 8SW RF SOI client chips on 300mm platform for next-generation mobile applications

09/26/2018  RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

U.S.-China trade war heats up with semiconductor industry caught in the middle

09/25/2018  Earlier this week, the U.S. Trade Representative (USTR) released a 10 percent tariff on $200 billion in imports from China, including more than 90 tariff lines central to the semiconductor industry.

Semiconductor analyst Mark Lipacis to present featured keynote at GSA Silicon Summit

09/25/2018  Managing Director of Jefferies Group LLC to discuss next semiconductor growth opportunity at October 9 conference, which is designed to advance technology, business and collaboration.

Oxygen vs. nanochip

09/25/2018  Scientists show the vulnerability of a promising two-dimensional semiconductor to air, and discover new catalyst.

IBM Research - Almaden vice president to keynote at The ConFab 2019

09/25/2018  The ConFab, preeminent semiconductor manufacturing and design conference slated for May 14-17, announces IBM VP and lab director will deliver address on advanced computing technologies for AI.

Professors from MIT, University of Illinois at Urbana-Champaign to be honored for excellence in semiconductor research

09/24/2018  Professors Hoyt and Shanbhag will receive the awards in conjunction with the SIA Annual Award Dinner on Nov. 29, 2018 in San Jose, Calif.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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