Semiconductors

SEMICONDUCTORS ARTICLES



TSV based memory going to volume production: the era of 3DIC finally begins

12/01/2014  With the recent Samsung announcement of mass production of 64 GB DDR4 DIMMs that use TSV technology for enterprise servers and cloud-based applications, all three of the major DRAM memory manufactures, Samsung, Hynix and Micron, have now announced the commercialization of TSV based memory architectures.

Cymer announces its new XLR 700ix DUV light source

12/01/2014  Cymer, LLC, an ASML company, a supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its new argon fluoride (ArF) immersion light source, the XLR 700ix.

EV Group establishes nanoimprint lithography competence center for photonic applications

12/01/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the NILPhotonics Competence Center.

Van der Waals force re-measured

11/26/2014  Although the van der Waals force was discovered around 150 years ago, it is still difficult to quantify when predicting the behaviour of solids, liquids, and molecules.

Protons fuel graphene prospects

11/26/2014  Published in the journal Nature, the discovery could revolutionise fuel cells and other hydrogen-based technologies as they require a barrier that only allow protons - hydrogen atoms stripped off their electrons - to pass through.

Slideshow: IEDM 2014 Preview

11/26/2014  Browse for an advance look at some of the most newsworthy topics and papers to be presented at the 60th annual meeting, to be held at the Hilton San Francisco Union Square Hotel from December 15-17, 2014.

Research yields material made of single-atom layers that snap together like Legos

11/25/2014  Physicists at the University of Kansas have fabricated an innovative substance from two different atomic sheets that interlock much like Lego toy bricks.

GIGAPHOTON provides new function for 50% reduction of neon gas consumption for ArF immersion laser users

11/25/2014  Gigaphoton Inc., a lithography light source manufacturer, today announces the provision of a new function, called “eTGM (eco-Total Gas Management),” for the existing users of its flagship high-output GT Series of ArF immersion laser products free of charge for a fixed period of time.

Micron Technology CFO to retire in 2015

11/24/2014  Micron Technology, Inc. announced that Ronald C. Foster, Chief Financial Officer (CFO) and Vice President of Finance, will retire from Micron next year.

Hybrid Memory Cube Consortium releases new specification

11/24/2014  The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

PDSTI completes acquisition of Montage

11/24/2014  Montage Technology Group Limited, a global fabless provider of analog and mixed-signal semiconductor solutions addressing the home entertainment and cloud computing markets, today announced that Montage Technology Global Holdings, Ltd., an entity jointly formed by Shanghai Pudong Science and Technology Investment Co., Ltd. and China Electronics Investment Holdings Limited, has completed its acquisition of the company.

Physicists and chemists work to improve digital memory technology

11/24/2014  The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

UO-industry collaboration points to improved nanomaterials

11/21/2014  A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

North American book-to-bill report shows equipment order activity has moderated

11/21/2014  North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

Paul A. Mascarena joins ON Semiconductor's board of directors

11/20/2014  ON Semiconductor Corporation today announced that Paul A. Mascarenas has joined its Board of Directors. The Board also appointed Mr. Mascarenas to its Science and Technology Committee.

China and US boost worldwide industrial semiconductor market in 2014

11/20/2014  Continuing strength in China and a resurgent U.S. economy are combining to drive accelerated growth in the worldwide market for semiconductors used in industrial applications this year, according to IHS Technology.

Carbonics aims for improved power consumption and performance with new carbon nanomaterials

11/19/2014  Startup is backed by $5.5M investment, leveraging carbon research conducted at UCLA and USC.

New process isolates promising material

11/18/2014  Molybdenum disulfide has emerged as a leading successor to graphene.

Notebook PC shipments rise year over year as tablet PCs decline

11/18/2014  Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

Revolutionary solar-friendly form of silicon shines

11/18/2014  Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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