10/24/2014  Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

10/23/2014  Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

10/22/2014  Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

10/22/2014  Adlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing (HVM)-readiness.

10/22/2014  Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

10/21/2014  Lam Research Corp., a global supplier of wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion module for deep silicon etch applications.

10/21/2014  University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

10/21/2014  Gigaphoton Inc. announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50 percent duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment.

10/21/2014  While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

10/20/2014  IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

10/17/2014  Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

10/17/2014  The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

10/16/2014  Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

10/16/2014  Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

10/15/2014  Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

10/15/2014  Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

10/15/2014  IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

10/14/2014  India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.