Semiconductors

SEMICONDUCTORS ARTICLES



New fabs invest over $220B; 2019 to mark all-time spending high

09/17/2018  Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending growth and the highest investment year for fab equipment in the history of the industry, according to the latest World Fab Forecast Report published today by SEMI.

Adesto completes acquisition of Echelon

09/14/2018  Adesto Technologies announced the successful completion of its previously announced acquisition of Echelon Corporation.

Axcelis appoints John Kulungian new VP of Quality

09/14/2018  Axcelis Technologies, Inc., a supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has appointed John Kulungian as vice president of quality.

Mentor's new LightSuite Photonic Compiler automated layout tool speeds integrated photonic design development

09/14/2018  Mentor, a Siemens business, today announced LightSuite Photonic Compiler -- the industry's first integrated photonic automated layout system.

Industry growth: Still positive but varies by region

09/14/2018  Manufacturing activity continues to expand -- but at a slowing pace.

MCUs sales to reach record-high annual revenues through 2022

09/13/2018  MCU sales and units shipments driven by the spread of embedded control in systems, more sensors, and the rush to connect end-use applications to the Internet of Things (IoT).

SUNY Poly professor awarded $500,000 National Science Foundation grant to develop next-gen memory

09/13/2018  NSF grant supports SUNY Poly research for scalable computing infrastructure that mimics the synaptic functionality of the human brain.

Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics

09/12/2018  Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study led by researchers at the University of Illinois at Chicago College of Engineering.

"Dreams Start Here" at SEMICON Japan 2018 in era of AI

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

2019 ECTC abstract submission deadline is October 8

09/11/2018  This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

Air Products to expand supply for Samsung Electronics' semiconductor fab in Giheung, South Korea

09/10/2018  Air Products today announced it has been awarded by Samsung Electronics additional gaseous nitrogen and hydrogen supply to its semiconductor fab in Giheung, South Korea.

SUTD researchers resolve a major mystery in 2D material electronics

09/10/2018  Researchers from the Singapore University of Technology and Design (SUTD) have made a major step forward in resolving the mysteries surrounding 2D material Schottky diode.

Worldwide semiconductor equipment billings reach $16.7B in second quarter 2018

09/10/2018  Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.

Nova's materials metrology solution selected for 5nm technology node

09/07/2018  Nova announced today that a major foundry recently placed an order for its VeraFlex advanced X-Ray metrology solution for 5nm technology node.

ASMC 2019 Call for Papers deadline is October 9, 2018

09/07/2018  Educate the industry about the latest in advanced processes and materials.

Top 10 semiconductor industry innovations

09/07/2018  Over the past three decades, most of the world’s innovations have centered largely on business models and involved iterative advances of existing technologies, with none matching the global impact of the top 10 semiconductor industry discoveries and advances, Dr. Morris Chang, founder of TSMC and the IC foundry model, said at SEMICON Taiwan 2018 this week.

Global semiconductor sales increase 17.4% year-to-year in July

09/06/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

GLOBALFOUNDRIES CTO Gary Patton to deliver opening keynote at GSA Silicon Summit

09/06/2018   Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY. 

Researchers use silicon nanoparticles for enhancing solar cells efficiency

09/06/2018  An international research group improved perovskite solar cells efficiency by using materials with better light absorption properties.

OEM Group introduces next-generation Spin Rinse Dryer (SRD)

09/05/2018  OEM Group announced a major engineering design upgrade of its Semitool Spin Rinse Dryer, a platform for removing residual chemicals from semiconductor substrates and other materials such as optical lenses.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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