07/22/2014  SEMI today announced the launch of the association's first-ever event in Latin America.

07/22/2014  North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI.

07/22/2014  This is the first in a series of 10 installments which will discuss fundamental truths about process control - inspection and metrology - for the semiconductor industry.

07/22/2014  Dongbu HiTek today announced the immediate availability of a Low Voltage BCDMOS Process (BD130LV) at the 0.13-micron node that is ideally suited for implementing the main Power Management IC (PMIC) for smart phones and tablet computers.

07/22/2014  Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

07/22/2014  Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

07/21/2014  Hughes Metras, Leti’s VP of Strategic Partnerships North America, introduced the lead talk at their SemiconWest 2014 Leti Day about monolithic 3D technology as the "solution for scaling."

07/18/2014  Edwards Limited is pleased to announce that Mike Czerniak, Product Marketing Manager Exhaust Gas Management, was honored with SEMI’s Merit Award during SEMICON West last week.

07/16/2014  eASIC Corporation, a provider of Single Mask Adaptable ASIC devices, today announced the appointment of Ron Jankov to the company’s Board of Directors.

07/16/2014  TriQuint Semiconductor, Inc., an RF solutions supplier and technology innovator, announced that it has reached a defense production milestone, successfully completing the Defense Production Act Title III Gallium Nitride on Silicon Carbide Production Capacity program.

07/16/2014  Teradyne, Inc. announced the election of Mercedes Johnson to its Board of Directors. Ms. Johnson was also appointed to the Board’s Audit Committee.

07/15/2014  IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

07/15/2014  Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

07/15/2014  Graphene has attracted overwhelming attention both for exploring fundamental science and for a wide range of technological applications.

07/15/2014  Technology node transitions slowing below 32nm.

07/10/2014  A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

07/10/2014  Technology innovation isn’t slowing down. But its steady acceleration isn’t happening spontaneously, and Tuesday’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.