07/08/2014  On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

07/08/2014  Everybody loves FinFETs! Well, not everybody, really, is behind double-gate or multiple-gate field-effect transistors.

07/08/2014  Extreme-ultraviolet lithography is making progress! Well, check that. EUV technology is progressing, yet it remains uncertain when its insertion into volume production of semiconductors will occur.

07/08/2014  Intel, Samsung Electronics, and Taiwan Semiconductor Manufacturing have made their moves into three-dimensional semiconductors. Now it remains to be seen how the rest of the semiconductor industry will make the transition to 3DICs.

07/08/2014  A collection of the first fully patterned 450mm wafers are on display at SEMICON West this week at the newly merged SUNY CNSE/SUNYIT exhibit, booth 517, located in the Moscone Center’s South Hall. The wafers will be on display throughout the exhibition and showcased in the 450 mm Technology Development Session on Thursday July 10th.

07/08/2014  Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

07/08/2014  The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

07/08/2014  Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel.

07/08/2014  Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

07/08/2014  Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once the merger closes.

07/08/2014  James C. Morgan, chairman emeritus, Applied Materials, Inc., today announced his commitment to match up to $500,000 in donations to the SEMI Foundation.

07/08/2014  The long night in solar energy may be coming to an end.

07/08/2014  With mobile devices continuing to shrink in size and wearable electronics emerging as a new market for semiconductors, advanced packaging technologies are taking on increasing importance in the global supply chain. Aside from the 3DIC package/system-in-package area, what is going on in semiconductor packaging these days?

07/08/2014  In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.

07/07/2014  Orbotech Ltd. today announced the acquisition of SPTS Technologies Group Limited, a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others.

07/07/2014  FinScale Incorporated, the semiconductor device and process innovation company, today announced immediate availability of its qFinFETTM technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers

07/07/2014  SEMI today announced that Martin Anstice, president and CEO, Lam Research Corporation; Kevin Crofton, president and COO, SPTS Technologies; Tien Wu, COO, ASE Group; and Guoming Zhang, executive vice president, Sevenstar Electronics, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

07/07/2014  SEMI projects back-to-back years of double-digit growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released here today at the annual SEMICON West exposition.

07/07/2014  Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

07/07/2014  As dimensional scaling has reached the diminishing return era there is a buildup of interest in monolithic 3D as an alternative path forward.