Semiconductors

SEMICONDUCTORS ARTICLES



Nanolab Technologies acquires Microtech Laboratories, LLC

07/02/2014  Nanolab Technologies, Inc. announced today that it has acquired Microtech Laboratories, LLC a well-established Dallas, Texas, failure analysis laboratory founded in 1999.

TowerJazz to establish new office in Kyoto, Japan

07/01/2014  TowerJazz today announced the opening of a new sales and support office in Japan. The office is situated in Kyoto and will be the central base of Japanese sales, technical support and other services.

Bending the rules

07/01/2014  A UCSB postdoctoral scholar in physics discovers a counterintuitive phenomenon: the coexistence of superconductivity with dissipation.

Stanford engineers envision an electronic switch just 3 atoms thick

07/01/2014  Computer simulation shows how to make a crystal that would toggle like a light switch between conductive and non-conductive structures; this could lead to flexible electronic materials and enable a cell phone to be woven into a shirt.

Gigaphoton develops world's first helium-free purge process for ArF immersion lasers

06/30/2014  Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in the development of an innovative purge process, one that does not use the rare gas helium, for its flagship "GT Series" of ArF immersion lasers.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

06/30/2014  EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Gigaphoton achieves 92W EUV light source output

06/30/2014  Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has successfully achieved 92 W EUV light source output at 4.2 percent conversion efficiency (CE) on its prototype laser-produced plasma (LPP) light sources for EUV lithography scanners.

Breakthrough research in the semiconductor industry

06/30/2014  Research forms the DNA of the semiconductor industry — few other industries invest as much as a percentage of revenue.

Winfried Kaiser to receive the SEMI Sales and Marketing Excellence Award

06/27/2014  SEMI today announced that Winfried Kaiser, senior vice president Product Strategy Lithography Optics at ZEISS, has been selected as the 2014 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

“What comes next?” — Latest technology breakthroughs featured at SEMICON West

06/27/2014  The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco, Calif.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

06/25/2014  The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Is silicon wafer pricing on its way up again?

06/25/2014  Silicon wafer volumes recover; revenues forecasted to improve. Techcet forecasts $8.7B on 9,500 MSI Si by 2015.

The bright future of Si photonics

06/25/2014  Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.

ConFab panelists discuss optimizing R&D in the changing semi landscape

06/24/2014  Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

SMIC establishes the first 12 in CIS supply chain in China

06/24/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter and micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics of Shanghai

Singapore researchers use FEI Titan S/TEM to link plasmonics with molecular electronics

06/24/2014  The National University of Singapore, Singapore University of Technology and Design, and the A*STAR institutes: Institute of High Performance Computing and Institute of Materials Research and Engineering announced their recent discovery of quantum plasmonic tunneling.

SPTS and CEA-Leti/Nanoelec collaborate on 3D-TSV

06/24/2014  SPTS Technologies, a manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies.

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

06/23/2014  Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Collecting light with artificial "moth eyes"

06/23/2014  Empa researchers have developed such a photoelectrochemical cell, recreating a moth’s eye to drastically increase its light collecting efficiency. The cell is made of cheap raw materials – iron and tungsten oxide.

Texas Instruments promotes Brian Crutcher to executive vice president, Steve Anderson to lead Analog

06/23/2014  Texas Instruments Incorporated has promoted Brian Crutcher to executive vice president of Business Operations with oversight for the company's product lines and sales.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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