Semiconductors

SEMICONDUCTORS ARTICLES



At The ConFab 2014: Do we still need Moore’s Law?

06/23/2014  Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm’s keynote “What’s On Our Mind” on Monday morning when he asked, “Should we pursue Moore's Law unconditionally?"

imec joins Graphene Flagship

06/23/2014  To coincide with Graphene Week 2014, the Graphene Flagship is proud to announce that today one of the largest-ever European research initiatives is doubling in size.

Micron collaborates with Intel on on-package memory solution, leveraging 3D memory technology

06/23/2014  Micron Technology, Inc., a provider of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing.

Avago Technologies to acquire PLX

06/23/2014  Avago Technologies and PLX Technology, Inc. announced today that they have entered into a definitive agreement under which Avago will acquire PLX, a developer of PCI Express silicon and software connectivity solutions.

GlobalFoundries presents first global Supplier Awards

06/23/2014  JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership.

Noise cancellation: The new failure and yield analysis superpower

06/22/2014  Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

HVM production and challenges of UHP PDMAT for ALD-TaN

06/22/2014  For sub-22nm device generations, device manufacturers are likely to adopt PDMAT precursor for ALD-TaN barrier films for copper interconnect structures.

Bookings and billings maintain a consistent pace in May 2014

06/20/2014  North American semiconductor equipment industry posts May 2014 book-to-bill ratio of 1.00.

Subatmospheric gas storage and delivery: Past, present and future

06/19/2014  Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

Advanced Materials Developer Inpria raises $1.45M from Oregon Angel Fund

06/19/2014  Inpria Corporation, a developer of high-resolution photoresists, announced today that it has received additional equity investment and commitments totaling $1.45 million

450mm transition toward sustainability: Facility and infrastructure requirements

06/19/2014  Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

GS Nanotech pioneers 3D packaging technology in Russia

06/19/2014  GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

Entegris opens new facility in Bedford, MA

06/19/2014  Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

UC Riverside to lead new energy frontier research center project

06/18/2014  SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

memsstar relocates; Increases manufacturing capacity by 40%

06/18/2014  memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced that it has relocated to a new, larger facility.

SEMI releases first quarter 2014 worldwide PV equipment market report

06/18/2014  Bookings recover for second consecutive quarter; above parity for first time since 2011

Boston Semi Equipment acquires MVTS Technologies

06/17/2014  Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

Cadence completes acquisition of Jasper Design Automation

06/17/2014  Cadence Design Systems, Inc. today announced that it has completed the acquisition of Jasper Design Automation, Inc.

The GaN power industry is consolidating in preparation for significant growth

06/17/2014  The power supply/PFC segment will dominate the business from 2015-2018, ultimately representing 50 percent of device sales. At that point, automotive will then catch-up.

200mm equipment market gaining new lease on life

06/16/2014  In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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