05/27/2014  Synopsys, Inc. today announced the validation of DesignWare IP in the TSMC 16nm FinFET process technology, demonstrating the ongoing collaboration between Synopsys and TSMC to provide designers with proven IP for their advanced system-on-chip (SoC) designs.

05/23/2014  Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

05/23/2014  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

05/22/2014  A new remedy has been found to tackle the difficulty of controlling layered nanomaterials. Control can be improved by simply bending the material.

05/22/2014  Researchers at the National Institute of Standards and Technology (NIST), working in collaboration with the Naval Research Laboratory, have found that a particular species of quantum dots that weren't commonly thought to blink, do.

05/22/2014  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and ISSC Technologies Corporation (ISSC) today announced that Microchip has signed a definitive agreement to acquire ISSC.

05/22/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etching.

05/21/2014  BCC Research reveals in its new report, Thin-layer Deposition: CVD, Ion Implantation and Epitaxy, the global market for chemical vapor deposition (CVD) is expected to grow to $6.8 billion by 2019, with a five-year CAGR of 6.3%.

05/21/2014  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that Sang Park, 67, has retired as Chairman, Chief Executive Officer and Director, effective immediately.

05/21/2014  Teardown analysis is a useful tool for understanding the component and manufacturing cost of electronics devices—but it doesn’t always tell the whole story of the value of a product.

05/21/2014  The ProPlus blog here on Solid State Technology has looked at giga-scale design challenges and, this year, so will the Design Automation Conference (DAC).

05/20/2014  ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

05/20/2014  The 17th annual IITC will be held May 21 – 23, 2014 in conjunction with the 31st AMC at the Doubletree Hotel in San Jose, California.

05/20/2014  Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

05/19/2014  Berkeley Lab researchers use light to dope graphene boron nitride heterostructures.

05/19/2014  Top 20 ranking shows that semiconductor industry company consolidation continues to accelerate.

05/19/2014  China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

05/19/2014  Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

05/16/2014  After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

05/16/2014  One way to make Li-ion batteries more durable, safer, smaller and in particularly faster, is a transition towards all solid-state 3D thin-film Li-ion batteries.