05/16/2014  Only a direct measurement of SRAM structures can represent true variations of metal gate height due to CMP process and is strongly affected by the design and layout of pattern, including pattern density, dummy design, and spacing.

05/16/2014  Although on-chip interconnects have not been scaling at the same speed as other parts of the chip, new capabilities enabled by graphene and CNTs, among other materials, could soon change that.

05/15/2014  Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps.

05/15/2014  There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

05/15/2014  Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

05/14/2014  A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices.

05/14/2014  A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

05/14/2014  Transphorm Inc. today announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s extensive Gallium Nitride (GaN) power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.

05/14/2014  Element Six today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices.

05/13/2014  Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.

05/13/2014  Dow Corning today introduced Dow Corning EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components.

05/13/2014  Applied Materials, Inc. today announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

05/13/2014  In this key role, Papa Rao will serve as the operational lead, overseeing the strategic development of SEMATECH’s manufacturing, process, materials and ESH-related activities.

05/09/2014  SEMATECH announced today that researchers have reported progress which could significantly improve resist sensitivity by incorporating metal oxide nanoparticles for extreme ultraviolet (EUV) lithography.

05/09/2014  Environmentally friendly solar cell pushes forward the "next big thing in photovoltaics."

05/08/2014  Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

05/08/2014  BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.

05/07/2014  In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

05/07/2014  University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC) are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.

05/07/2014  GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.