Semiconductors

SEMICONDUCTORS ARTICLES



Graphene not all good

04/29/2014  In a first-of-its-kind study of how a material some think could transform the electronics industry moves in water, researchers at the University of California, Riverside Bourns College of Engineering found graphene oxide nanoparticles are very mobile in lakes or streams and therefore likely to cause negative environmental impacts if released.

How to create nanowires only 3 atoms wide with an electron beam

04/29/2014  Junhao Lin, a Vanderbilt University Ph.D. student and visiting scientist at Oak Ridge National Laboratory (ORNL), has found a way to use a finely focused beam of electrons to create some of the smallest wires ever made.

Scaling to 5nm: A plethora of paths

04/28/2014  Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.

SEMATECH appoints IBM veteran to direct strategic growth initiatives

04/28/2014  Dr. Barth will join SEMATECH’s executive management team and will be responsible for cultivating effective alliance relationships and driving key strategic partnerships that align with the company’s core business objectives and long-term value creation and growth.

MACOM launches new 55 W GaN on SiC pulsed power transistor

04/28/2014  M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced a new GaN on SiC HEMT Pulsed Power Transistor for civilian and military radar pulsed applications.

Freescale appoints Dan Durn as CFO

04/25/2014  Freescale Semiconductor today announced that it has selected Dan Durn as senior vice president and chief financial officer, replacing current CFO, Alan Campbell, who announced his decision to retire in January of this year.

SEMICON Southeast Asia to be launched in 2015

04/25/2014  Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI today announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia.

Will interconnect manufacturing requirements cramp Moore's Law's style?

04/25/2014  The recent years have seen considerable contention in the semiconductor industry on whether Moore’s Law is alive and well.

imec reports 4 percent growth in 2013 fiscal year

04/24/2014  Revenue for 2013 totaled 332 million euro, a four percent growth from the previous year.

IEEE Photonics Society announces Call For Papers

04/24/2014  The IEEE Photonics Conference 2014 (IPC-2014) has announced a Call for Papers seeking original technical presentations in lasers, optoelectronics, optical fiber networks and related topics for the industry?s premier fall photonics conference.

Spansion adds to flash memory portfolio

04/24/2014  Spansion is adding three new Serial NOR and three new NAND memory densities specifically qualified to meet the extended temperature ranges and stringent quality requirements of the automotive industry.

Contour Semiconductor names former Intel exec as new CEO

04/22/2014  Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.

High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

04/22/2014  By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University's Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

04/22/2014  The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

"Exotic" material is like a switch when super thin

04/21/2014  Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick.

SanDisk donates $1M to Berkeley College of Engineering

04/21/2014  The donation will fund recently completed renovations to Cory Hall, home of the College’s Department of Electrical Engineering and Computer Sciences, and the undergraduate student Computing Lab, which has been renamed the SanDisk Computing Lab.

Cadence to acquire Jasper Design Automation

04/21/2014  Cadence Design Systems, Inc. today announced plans to acquire Jasper Design Automation, Inc., a provider of formal analysis solutions, for approximately $170 million in cash.

Altera and TSMC collaborate to bring advanced packaging technology to Arria 10 FPGAs and SoCs

04/21/2014  Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

04/18/2014  Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

LG-Swiss researchers announce graphene membrane breakthrough

04/18/2014  The findings open up the possibility in the future to develop highly efficient filters to treat air and water.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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