Semiconductors

SEMICONDUCTORS ARTICLES



SEMI reports 2013 global semiconductor equipment sales of $31.6 billion

03/12/2014  SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.

Bending light with a tiny chip

03/11/2014  The Caltech chip eliminates the need for bulky and expensive lenses and bulbs and instead uses a so-called integrated optical phased array (OPA) to project the image electronically with only a single laser diode as light source and no mechanically moving parts.

Samsung now mass producing the most advanced 4Gb DDR3 using 20nm process technology

03/11/2014  Samsung Electronics today announced that it is mass producing the most advanced DDR3 memory, based on a new 20nm process technology, for use in a wide range of computing applications.

Leti demonstrates ultra-scaled self-aligned split-gate memory cell with 16nm gate length

03/11/2014  CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

03/11/2014  Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

Plug-and-play test strategy for 3D ICs

03/11/2014  Three-dimensional (3D) ICs, chips assembled from multiple vertically stacked die, are coming. They offer better performance, reduced power, and improved yield.

DSA, EUV, nanopatterning are top themes at SPIE Advanced Lithography

03/10/2014  Progress through collaborative efforts in directed self-assembly (DSA), the state of the art in nanoimprint technology, 3D approaches to scaling, and the latest on extreme ultraviolet (EUV) lithography research were hot topics at the recent SPIE Advanced Lithography symposium in San Jose.

SiC power device advantages enhance power conversion systems

03/10/2014  Compared to silicon, SiC has ten times the dielectric breakdown field strength, three times the bandgap and three times the thermal conductivity.

Promising news for solar fuels from Berkeley Lab researchers at JCAP

03/07/2014  A JCAP study shows that nearly 90-percent of the electrons generated by a semiconductor/cobaloxime hybrid catalyst designed to store solar energy in hydrogen are being stored in their intended target molecules.

MACOM introduces new addition to GaN in Plastic series

03/07/2014  M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

Semtech Corporation announces the appointment of new Executive VP

03/07/2014  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

Weaker yen impact on the 2013 material and equipment market size

03/06/2014  Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Micron appoints Darren Thomas as VP of Storage Business Unit

03/06/2014  Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

Fab equipment spending to increase 20-30% in 2014

03/06/2014  The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

New research could help make "roll-up" digital screens a reality for all

03/06/2014  Researchers from the University of Surrey worked together with scientists from Philips to further develop the 'Source-Gated-Transistor' (SGT) - a simple circuit component invented jointly by the teams.

Samsung expands its 28nm technology offerings

03/06/2014  Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

University of Minnesota professor recognized for excellence in semiconductor research

03/06/2014  The Semiconductor Industry Association this week presented its University Research Award – in consultation with Semiconductor Research Corporation (SRC) – to University of Minnesota professor Sachin Sapatnekar in recognition of his outstanding contributions to semiconductor research.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

03/05/2014  Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Moore's Law has stopped at 28nm

03/05/2014  While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

Researchers at UC study zero-dimensional quantum dots

03/04/2014  Zero-dimensional quantum dots identified by University of Cincinnati researchers could someday have a big effect on a variety of technologies, such as solar energy, lasers and medical diagnostics.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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