Semiconductors

SEMICONDUCTORS ARTICLES



How 19th century physics could change the future of nanotechnology

03/04/2014  A new twist on a very old physics technique could have a profound impact on one of the most buzzed-about aspects of nanoscience.

Silicon Labs acquires low-power analog IC products

03/04/2014  Silicon Labs today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc.

Failure analysis and the innovative pinpoint conductive AFM

03/04/2014  One of the most challenging issues in the semiconductor industry is the failure analysis (FA) investigation of devices with enduringly shrinking geometries down to single digit nanometer trench widths.

Busch Vacuum Pumps and Systems joins F450C Consortium

03/04/2014  The Facilities 450mm Consortium (F450C), a partnership of nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced Busch Vacuum Pumps and Systems as the eleventh member company to join the consortium.

Global semiconductor industry posts highest-ever January sales

03/03/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $26.28 billion for the month of January 2014, an increase of 8.8 percent from January 2013 when sales were $24.15 billion, marking the industry's highest-ever January sales total and the largest year-to-year increase in nearly three years.

New SEMICON Europa in Grenoble to emphasize innovation and applications

03/03/2014  SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

Intermolecular announces agreement with SanDisk and Toshiba

02/28/2014  Intermolecular, Inc. today announced that the development activity related to the Collaborative Development Program agreement with SanDisk and Toshiba has reached its successful conclusion.

3D NAND: To 10nm and beyond

02/28/2014  In launching the iPod music player, Apple bumped consumption of NAND flash – a type of non-volatile storage device – driving down cost and paving the way for the growth of the memory technology into what is now a multibillion dollar market, supplying cost-effective storage for smart phones, tablets and other consumer electronic gadgets that do not have high density requirements.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

02/26/2014  GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

eBeam Initiative announces key educational themes for 2014

02/26/2014  The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the top educational themes that it will highlight in 2014.

JILA physicists discover "quantum droplet" in semiconductor

02/26/2014  JILA physicists used an ultrafast laser and help from German theorists to discover a new semiconductor quasiparticle—a handful of smaller particles that briefly condense into a liquid-like droplet.

Renesas Electronics embeds the largest Flash and SRAM together

02/26/2014  Renesas Electronics Corporation today unveiled the RX64M Group of microcontrollers (MCUs), its first product in the flagship RX Family of 32-bit MCUs to be fabricated in a 40nm process.

SRC and MIT extend high resolution lithography capabilities

02/26/2014  MIT researchers sponsored by Semiconductor Research Corporation have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.

Movidius joins the Global Semiconductor Alliance

02/24/2014  Movidius today announced that it has joined the Global Semiconductor Alliance (GSA).

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

02/24/2014  SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

International Rectifier opens ultra-thin wafer processing facility in Singapore

02/24/2014  International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

Europe launches PLACYD, a large consortium to address DSA lithography

02/24/2014  PLACYD, an EU funded consortium of industrial and academic collaborators and led by Arkema will establish a dedicated material manufacturing facility that allows the production of block copolymers meeting the rigorous standards required for their use in industry as nanolithographic templates.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

02/21/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Frost & Sullivan recognize RFaxis with Award for Technology Innovation Leadership

02/21/2014  Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan recognizes RFaxis, Inc. with the 2014 North American Frost & Sullivan Award for Technology Innovation Leadership.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

02/21/2014  Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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