Semiconductors

SEMICONDUCTORS ARTICLES



Single chip device to provide real-time 3-D images from inside the heart and blood vessels

02/20/2014  Researchers have developed the technology for a catheter-based device that would provide forward-looking, real-time, three-dimensional imaging from inside the heart, coronary arteries and peripheral blood vessels.

Semiconductor industry posts record sales in 2013

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

2014 SPIE Startup Challenge winners announced

02/20/2014  A microscope in a needle, a handheld device that prescribes corrective eyeglasses, and a device for heart attack diagnosis are winning projects in the 2014 SPIE Startup Challenge.

Reframing the Roadmap: ITRS 2.0

02/20/2014  The International Technology Roadmap for Semiconductor (ITRS) is being reframed to focus more on end applications, such as smartphones and micro-servers.

Using holograms to improve electronic devices

02/20/2014  A team of researchers from the University of California, Riverside Bourns College of Engineering and Russian Academy of Science have demonstrated a new type of holographic memory device that could provide unprecedented data storage capacity and data processing capabilities in electronic devices.

Plasma-Therm signs cross-licensing agreement with ON Semiconductor

02/20/2014  Plasma-Therm announced today that it has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.

Samsung, Intel Capital and Applied Materials fund Inpria to develop advanced semiconductor materials

02/20/2014  Inpria Corporation announced today that it has received $4.7M of a committed $7.3M financing. The round was led by Samsung Venture Investment Corporation, the global investment arm of the Samsung Group, along with significant participation from Intel Capital, Intel’s global investment and M&A organization.

The most expensive SRAM in the world - 2.0

02/20/2014  Embedded SRAM scaling is broken and, with it, Moore's Law.

Avantor Performance Materials names Jean-Paul Mangeolle to Board of Directors

02/19/2014  Avantor Performance Materials, a global manufacturer and supplier of high-performance chemistries, announces the appointment of Jean-Paul Mangeolle to its Board of Directors.

Silicon-germanium chip sets new speed record

02/18/2014  A research collaboration consisting of IHP-Innovations for High Performance Microelectronics in Germany and the Georgia Institute of Technology has demonstrated the world's fastest silicon-based device to date.

World's first 79 GHz radar transmitter in 28nm CMOS

02/18/2014  Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

Breakthrough development in 1D-1R memory cell array

02/18/2014  Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

SiC & GaN power semiconductors leads power discrete market by 2018

02/18/2014  Analysts at ReportsNReports forecast the Global Power Discrete market to grow at a CAGR of 8.43% over the period 2013-2018.

GaN Systems appoints Tony Astley as Director of European Operations

02/18/2014  GaN Systems Inc, a developer of gallium nitride power switching semiconductors, has announced the appointment of Tony Astley as Director of European Operations.

MACOM acquires Nitronex

02/18/2014  M/A-COM Technology Solutions Inc., a supplier of high performance analog, RF, microwave and millimeter wave products, last week announced that it has acquired Nitronex, LLC.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

02/18/2014  Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

Dow Electronic Materials launches CMP polishing pads

02/14/2014  Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.

Honeywell introduces new copper manganese sputtering targets

02/14/2014  Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.

Advanced Energy highlights enabling pulsing tech for 2X/1Xnm at SEMICON Korea 2014

02/13/2014  Advanced Energy Industries, Inc. today will highlight its advanced pulsing technology at SEMICON Korea 2014.

How to make the wonder material graphene superconducting

02/13/2014  Whenever a new material is discovered, scientists are eager to find out whether or not it can be superconducting. This applies particularly to the wonder material graphene.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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