01/23/2014  At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

01/23/2014  New technology eliminates the need for specialized equipment for wafer pre- or post-treatment.

01/23/2014  Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

01/23/2014  At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

01/23/2014  As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

01/21/2014  The 2014 Optical Interconnects Conference, sponsored by the IEEE Photonics Society, announces a Call for Papers for the 25th anniversary of this premier conference, dedicated to bringing advanced interconnect technologies from research labs to commercial realization.

01/21/2014  A new technique from an international team of researchers working at Berkeley Lab’s Advanced Light Source (ALS) promises to deliver the goods.

01/21/2014  The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

01/21/2014  Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

01/21/2014  On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

01/16/2014  The market for 3DICs globally is forecast to reach USD 7.52 billion by 2019, according to a new market report published by transparency market research.

01/16/2014  ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

01/15/2014  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, has launched a significant new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

01/15/2014  The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

01/15/2014  SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

01/14/2014  A modest recovery in personal computers this year is expected to slightly strengthen overall sales growth in microprocessors, which is forecast to rise 9 percent in 2014 to a record-high $66.7 billion compared to $61.0 billion in 2013.

01/14/2014  Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

01/13/2014  Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

01/10/2014  Toppan Photomasks, Inc. (TPI) is saddened to announce the death of President and CEO David Murray after a long battle with cancer. Mr. Murray was 55 years old.