Semiconductors

SEMICONDUCTORS ARTICLES


Laser light at useful wavelengths from semiconductor nanowires

12/05/2013  Nanowire lasers could work with silicon chips, optical fibers, even living cells.
Worldwide semiconductor revenue grew 5.2 percent in 2013

12/04/2013  Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Micron Technology appoints Rajan Rajgopal as VP of Quality

12/04/2013  Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.
Soitec announces high-volume manufacturing of new eSI substrates

12/04/2013  Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.
Cellphones pass PCs as biggest systems market and IC user

12/03/2013  Tablets and wireless networks are expected to show highest growth rates through 2017.
Imec simplifies i-PERC solar cell processing by implementing laser doping from ALD-Al2O3

12/03/2013  The cells achieved average conversion efficiencies of 20.2%.

Lab school brings manufacturing technologies to middle-school classrooms

12/03/2013  A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Sankalp Semiconductor appoints Dan Clein into its management team

12/03/2013  Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.
EV Group introduces full-field UV nanoimprint lithography system

12/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

12/03/2013  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.
Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

12/02/2013  Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

Semiconductor Industry Association begins leadership transition

11/27/2013  Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.

Soitec and SunEdison enter into patent license agreement

11/26/2013  Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.

Nanotubes can solder themselves, markedly improving device performance

11/26/2013  University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.
12) A New Memory Type – TRAM

11/26/2013 

10) Nonvolatile Logic-in-Memory Technology

11/26/2013 

9) Flexible High-Performance Nonvolatile Memory

11/26/2013 

7) Real-World Performance of Scaled InGaAs Devices

11/26/2013 

6) Dual-Channel Nanowire Transistors

11/26/2013 

2) Fully Integrated 27nm 16Gb ReRAM

11/26/2013 




WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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