11/25/2013  For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.

11/25/2013  Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.

11/25/2013  It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

11/21/2013  Rubicon Technology, Inc. today announced that Warren S. Stewart III has joined the Company as Senior Vice President of Sales and Marketing, effective immediately.

11/21/2013  Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

11/20/2013  SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

11/20/2013  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

11/19/2013  The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

11/19/2013  Leveraging EVG's expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

11/18/2013  Imagination Technologies announces a ground-breaking new camera Image Signal Processing (ISP) architecture codenamed 'Raptor.'

11/18/2013  Micron Technology, Inc. today announced the development of a fundamentally new computing architecture capable of performing high-speed, comprehensive search and analysis of complex, unstructured data streams.

11/18/2013  Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

11/15/2013  Despite their almost incomprehensibly small size – a diameter about one ten-thousandth the thickness of a human hair – single-walled carbon nanotubes come in a plethora of different “species,” each with its own structure and unique combination of electronic and optical properties.

11/15/2013  Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films.

11/14/2013  SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

11/13/2013  SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline.

11/11/2013  Tosoh Corporation announced today that Tosoh Group company Tosoh SMD, Inc., will implement a major expansion at its Grove City, Ohio, operations to develop, produce, and support physical vapor deposition (PVD) sputtering targets for the new 450mm wafer semiconductor market.

11/11/2013  The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

11/11/2013  Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

11/11/2013  Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.