Semiconductors

SEMICONDUCTORS ARTICLES



Size matters in the giant magnetoresistance effect in semiconductors

10/21/2013  In a paper appearing in Nature's Scientific Reports, Dr. Ramesh Mani, professor of physics and astronomy at Georgia State University, reports that a giant magnetoresistance effect depends on the physical size of the device in the GaAs/AlGaAs semiconductor system.

TV semiconductor market growing despite decline in TV shipments

10/18/2013  Wireless video, network interfaces, multi-format decoders, LED backlighting boost average semiconductor content per TV.

Power management, industrial analog units post strong gains

10/18/2013  Total shipments of analog devices forecast to jump 14% in 2013.

Jury finds Qualcomm guilty of patent infringement

10/17/2013  ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.

Argument for not cleaning up process water is wafer thin

10/17/2013  When facilities management and water treatment company MSS Group was called in to clean up the process water in a globally renowned manufacturer of semiconductor wafers, the company was presented with an untreated water system suffering from significant corrosion.

Laser thermal anneal to boost performance of 3D memory devices

10/16/2013  Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.

Model-based hints: GPS for LFD success

10/16/2013  For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry. Due to resolution enhancement technology (RET) limitations at advanced nodes, we are seeing significantly more manufacturing issues, even in DRC-clean designs.

Intersil appoints Roger Wendelken as senior VP of worldwide sales

10/15/2013  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.

IBM develops sub-20nm nanofluidic channels for lab-on-chip

10/15/2013  At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

Jordan Valley lands order for FEOL tool

10/15/2013  Jordan Valley Semiconductors Ltd. received another order for its recently introduced JVX7300LMI scanning X-ray in-line metrology tool for patterned and blanket wafers

High mobility InGaAs MOSFETs get triangular

10/15/2013  A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

Blog Review October 14 2013

10/14/2013  Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

Semiconductor materials market to approach $50 billion in 2014

10/10/2013  SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.

Dow introduces new SOLDERON tin-silver plating chemistry for lead-free bump plating

10/09/2013  Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

Major leap towards graphene for solar cells

10/09/2013  Surprising result: Graphene retains its properties even when coated with silicon.

Ultraviolet light to the extreme

10/09/2013  For the first time, researchers have mapped this EUV emission and developed a theoretical model that explains how the emission depends on the three-dimensional shape of the plasma.

Pure-play foundries spending big on capital equipment

10/09/2013  Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

Silicon Labs launches the world’s most energy-friendly MCUs

10/09/2013  Silicon Labs, a developer of high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most energy-friendly 32-bit microcontrollers (MCUs) based on the ARM Cortex-M0+ processor.

Micron Technology appoints Thomas Snodgrass as VP of System Solutions

10/08/2013  Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

Alpha and Omega Semiconductor announces resignation of its CFO

10/08/2013  Alpha and Omega Semiconductor today reported that Mary L. Dotz, its Chief Financial Officer, has announced her resignation in order to pursue other interests.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts