10/08/2013  SPTS Technologies and imec announced a joint partnership to further advance micro- and nanosized components for BioMEMS.

10/08/2013  Imec today announced the release of its fully integrated silicon photonics platform (iSiPP25G) for high-performance optical transceivers (25Gb/s and beyond).

10/08/2013  EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 570R2R—the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool.

10/08/2013  An upcoming challenge of advanced-node design is the expected mask write time increase associated with the continued use of 193nm wavelength lithography.

10/07/2013  New Center will offer the global semiconductor ecosystem crucial patterning knowledge for sub-10nm technologies.

10/04/2013  Wyle has been awarded a task order valued at $14.9 million to provide analyses of military and commercial developmental semiconductor devices and components for the U.S. Air Force Research Laboratory at Wright-Patterson Air Force Base in Dayton, Ohio.

10/04/2013  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

10/04/2013  IBM devices with a 90nm gate pitch demonstrated the highest performance ever reported for a SiNW device at a gate pitch below 100 nm.

10/04/2013  The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

10/04/2013  Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.

10/04/2013  At the International Electron Devices Meeting (IEDM) in December, TSMC researchers will unveil a 16nm FinFET process that by many measures is one of the world’s most advanced semiconductor technologies.

10/04/2013  Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

10/02/2013  Intermolecular, Inc. today announced that it has named C. Richard Neely, Jr. as the company's chief financial officer (CFO) and senior vice president.

10/02/2013  Applied Micro Circuits Corporation, also known as AppliedMicro, today announced it has appointed semiconductor veteran Douglas T. Ahrens to serve as Vice President and Chief Financial Officer.

10/02/2013  Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

10/02/2013  A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

10/02/2013  STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

10/02/2013  InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

10/02/2013  Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

10/01/2013  Fairchild Semiconductor, a global supplier of high performance power and mobile semiconductor solutions, has appointed Chris Allexandre to the position of Senior Vice President of Worldwide Sales.