Semiconductors

SEMICONDUCTORS ARTICLES



Noel Technologies now providing 450mm wafer services

10/01/2013  Semiconductor wet processes, etches and cleans, resist spin coatings and films the first services available

World record solar cell with 44.7% efficiency

09/30/2013  The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

Alpha and Omega Semiconductor launches new DrMOS-IIIS power modules

09/30/2013  Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today launched the AOZ5019, a third-generation high efficiency power module with an EZPair package.

Gigaphoton develops CO2 drive laser for high output EUV light sources

09/30/2013  Gigaphoton Inc. announced today that the company has jointly developed a high power CO2 drive laser for Extreme Ultraviolet (EUV) light sources with Mitsubishi Electric Corporation. Likewise, an average output level of 15W was achieved on a development EUV system – representing another step forward in realizing production level EUV light sources.

A new photoresist technology for organic semiconductors enabling submicron patterns

09/26/2013  Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

With carbon nanotubes, a path to flexible, low-cost sensors

09/25/2013  Researchers at the Technische Universitaet Muenchen (TUM) are showing the way toward low-cost, industrial-scale manufacturing of a new family of electronic devices.

SPICEing up circuit design

09/25/2013  Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about the challenges of designing for yield using SPICE models.

Micron ships first samples of Hybrid Memory Cube

09/25/2013  Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

Stanford scientists publish theory, formula to improve 'plastic' semiconductors

09/24/2013  A better understanding of the conductive properties of flexible semiconductors will aid in the development of bendable electronics.

Applied Materials to merge with Tokyo Electron

09/24/2013  Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

Semtech named to Fortune’s list of 100 Fastest Growing Companies

09/24/2013  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced that it has moved up four points on the Fortune Magazine list of the 100 Fastest Growing Companies that was published in the magazine’s September 16, 2013 issue.

MACOM releases industry’s first surface mount L-Band 90W GaN power module

09/24/2013  MACOM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products.

Micron and imec extend research collaboration

09/24/2013  Imec and Micron Technology, Inc. announced today a three-year extension of their strategic research collaboration on advanced CMOS scaling and expanded on additional joint research efforts.

Promising new alloy for resistive switching memory

09/20/2013  Tiny nanoscale filaments could be breakthrough for smaller, denser memory devices.

Densest array of carbon nanotubes grown to date

09/20/2013  New technique could one day help improve the performance of microelectronics in devices ranging from batteries to spacecraft.

NXP NextPowerS3 MOSFETs offer super-fast switching with soft recovery

09/20/2013  Industry’s first MOSFET platform to deliver integrated Schottky performance with low leakage current.

Mentor Graphics and TSMC collaborate on reference flow for 16nm FinFet process technology

09/20/2013  Mentor Graphics Corp. today announced that it has completed enhancements to its digital tool set for TSMC’s 16nm FinFET manufacturing processes.

Graphene Frontiers awarded $745k NSF grant for ‘roll-to-roll’ graphene production

09/19/2013  Graphene Frontiers, a Philadelphia-based advanced materials and nanotechnology company, has been awarded a $744,600 grant from the National Science Foundation. The funds will be used to develop roll-to-roll production of graphene.

SEMI book-to-bill ratio indicates bookings decline

09/19/2013  North America-based manufacturers of semiconductor equipment posted $1.06 billion in orders worldwide in August 2013 (three-month average basis) and a book-to-bill ratio of 0.98, according to the August EMDS Book-to-Bill Report published today by SEMI.

Worldwide semiconductor manufacturing equipment spending to decline 8.5 percent in 2013

09/19/2013  Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion in 2013, an 8.5 percent decline from 2012 spending of $37.8 billion, according to Gartner, Inc.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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