Semiconductors

SEMICONDUCTORS ARTICLES



RFMD introduces world’s first 6-inch GaN-on-SiC wafers for RF power transistors

09/19/2013  RFMD today introduced the world's first 6-inch GaN-on-Silicon Carbide (SiC) wafers for manufacturing RF power transistors for both military and commercial use.

A new training methodology needed

09/18/2013  We have an interesting dynamic in the world of semiconductor training that has been in play since the financial crisis in 2008-2009.

Logic gates in graphene technology

09/18/2013  Serial production of a QCA graphene cell could be possible. Simple, well-defined process steps are identified.

High temperature reverse bias reliability testing of high power devices

09/18/2013  Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

Inside the Hybrid Memory Cube

09/18/2013  The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

Megasonic Cleaning without Damage?

09/18/2013  Megasonics has been used considered and used for many years to meet many of the cleaning challenges, but it has been shown to cause damage to nanoscale device structures such as polysilicon lines.

Mobility now driving the industry

09/18/2013  It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

09/17/2013  TSMC forecast to sell $6.33 billion worth of ?28nm devices this year, a 3x increase over 2012.

Imec, KULeuven and AIST pave the way toward increased mobility of beyond 10nm MOS devices

09/17/2013  Tensile-strained GeSn MOSFET devices on Si developed using solid phase epitaxy.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

09/17/2013  Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Graphene photodetector integrated into a computer chip

09/16/2013  Both academia and the industry have high hopes for graphene. The material, which consists of a single layer of hexagonally arranged carbon atoms, has extraordinary properties.

Spansion licenses ARM processor technology to power embedded systems

09/16/2013  Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Entegris to partner with SEMATECH on surface conditioning and wafer cleaning technology

09/16/2013  Entegris, Inc. and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

MediaTek and Imagination expand partnership

09/13/2013  Imagination Technologies has signed a further license agreement with MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions.

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

09/13/2013  The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

Brewer Science’s new carbon nanotube materials are qualified for NRAM manufacturing

09/13/2013  Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

Brooks Automation appoints Lindon G. Robertson as CFO

09/13/2013  Brooks Automation, Inc. today announced the appointment of Lindon G. Robertson as executive vice president and chief financial officer, effective October 1, 2013.

Bruker announces acquisition of Prairie Technologies

09/13/2013  Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

The advantages of a hybrid scan test solution

09/12/2013  Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

SUNY CNSE to develop center for 450mm computer chip manufacturing

09/12/2013  Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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