09/10/2013  By blending their expertise, two materials science engineers at Washington University in St. Louis changed the electronic properties of new class of materials — just by exposing it to light.

09/10/2013  From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

09/10/2013  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013

09/10/2013  Researchers at North Carolina State University have created a new compound that can be integrated into silicon chips and is a dilute magnetic semiconductor – meaning that it could be used to make "spintronic" devices, which rely on magnetic force to operate, rather than electrical currents.

09/10/2013  More material could be saved when manufacturing wafers in future. Ultra-thin saws made of carbon nanotubes and diamond would be able to cut through silicon wafers with minimum kerf loss. A new method makes it possible to manufacture the saw wires.

09/10/2013  The Surface Mount Technology Association (SMTA)’s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

09/10/2013  A nanoparticle shaped like a spiky ball, with magnetic properties, has been uncovered in a new method of synthesising carbon nanotubes by physicists at Queen Mary University of London and the University of Kent.

09/09/2013  The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of the second annual eBeam Initiative survey.

09/09/2013  Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

09/06/2013  A new method to grow germanium crystals at low temperatures may lead to next-generation large-scale integrated circuits and future flexible electronics.

09/06/2013  DNA is the blueprint for life. Could it also become the template for making a new generation of computer chips based not on silicon, but on an experimental material known as graphene?

09/06/2013  SPTS Technologies this week announced the launch of its Sigma fxP physical vapor deposition (PVD) system for 300mm power device manufacturing.

09/05/2013  Some unexpected underdogs spur spending spree.

09/05/2013  The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

09/05/2013  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

09/04/2013  Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

09/04/2013  Chemical vapor deposition is a process used to deposit diverse thin films of crystalline or amorphous metal, inter-metallic compounds, oxides, nitrides, carbides, and inorganic polymer.

09/03/2013  Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

09/03/2013  Nanoelectronics research center imec of Belgium and Veeco Instruments Inc. are collaborating on a project aimed at lowering the cost of producing gallium nitride on silicon-based power devices and LEDs.

09/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.