07/03/2013 

Boston University filed a lawsuit against Apple Inc. and several other big tech companies over an alleged patent infringement, a thin film semiconductor technology that they claim was developed by one of their professors.

07/03/2013 

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

07/03/2013 

Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.

07/02/2013 

The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading handling system for (ultra) thin semiconductor wafers and a choice of laser processing modules, depending on the type of application.

07/02/2013 

Capacity for 200mm wafers forecast to slip more than 10 points during same period.

07/02/2013 

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.

07/02/2013 

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

07/01/2013 

Altair said it plans to use the capital to further strengthen its position in the single-mode LTE market as well as to support high volume product deployments from its largest customers.

07/01/2013 

Gigaphoton Inc. announced today that it has completed delivery of its first ArF immersion Excimer laser supporting 450mm multi-patterning, the GT64A.

07/01/2013 

Bringing us another step closer to reaching production level LPP EUV light sources.

06/24/2013 

Toshiba Corporation today announced that it will showcase its leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013.

06/24/2013 

While military applications continue to drive the GaN device market, commercial applications have emerged that will help fuel rapid market growth.

06/21/2013 

For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.

06/21/2013 

A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

06/21/2013 

UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.

06/20/2013 

Outlook for semiconductor equipment market improves, but remains soft in the short term.

06/20/2013 

Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.

06/19/2013 

Markets predicted by Maxtech International to reach >$5B by 2015.

06/19/2013 

Industry’s newfound maturity yields growth amid adversity.

06/18/2013  Most of the papers at this year’s EUVL Conference during SPIE’s 2014 Advanced Lithography program focused on topics relating to EUVL’s entrance into high volume manufacturing (HVM).