Semiconductors

SEMICONDUCTORS ARTICLES


SEMATECH names William R. Rozich chairman of the board

06/17/2013 

Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.
Samsung now mass producing industry’s first PCI-Express solid state drive

06/17/2013 

Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.
SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

06/17/2013 

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.
EVG and Dynaloy develop single-wafer cleaning solution

06/17/2013 

Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.
Imec and Renesas pioneer high-performance RF solutions in 28nm CMOS technology

06/14/2013 

The companies released this new development at this week’s VLSI circuits Symposium in Kyoto, Japan.
Imec shows multiple enhancement options for next-generation finFETs

06/13/2013 

Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.
US Army validates SiOnyx XQE sensor performance

06/13/2013 

SiOnyx Inc. announced independent validation of its image sensor technology.
UMC joins IBM chip alliance for 10nm process development

06/13/2013 

IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.
Producing cheaper and more flexible multiple thin crystalline silicon wafers

06/12/2013 

A team of researchers has found a way to make the manufacture of crystalline silicon materials faster and more affordable.
Alchimer to collaborate with imec on advanced nano-interconnect technologies

06/11/2013 

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.
World's first large(wafer)-scale production of III-V semiconductor nanowire

06/10/2013 

The research team demonstrated a novel method to epitaxially synthesize structurally and compositionally homogeneous and spatially uniform ternary InAsyP1-y nanowire on Si at wafer-scale using metal-organic chemical vapor deposition (MOCVD).
Altera Corp introduces Generation 10 FPGAs and SoCs

06/10/2013 

Altera Corporation today introduced its Generation 10 FPGAs and SoCs, offering system developers breakthrough levels of performance and power efficiencies.
eMemory and UMC expand non-volatile memory cooperation to advanced 28nm process

06/10/2013 

The agreement will broaden the foundry's specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.
Freescale appoints Krishnan Balasubramanian to board of directors

06/10/2013 

Mr. Balasubramanian (known as Bala) brings more than 37 years experience in the semiconductor industry to his new role on Freescale's board of directors.
Fujitsu touts GaN HEMT millimeter-wave transceiver

06/07/2013 

Fujitsu Laboratories Limited has launched millimeter-wave transceiver based on gallium-nitride high-electron mobility transistor (GaN HEMT). The device operates at frequencies up to the millimeter-wave band and features an output of 10W.
Silicon Labs to acquire Energy Micro

06/07/2013 

Silicon Labs today announced that it has signed a definitive agreement to acquire Energy Micro AS.
Olympus launches LEXT OLS4100 laser confocal microscope

06/07/2013 

New 3D measuring system offers auto brightness and high-speed stitching.
450mm – It’s bigger than you think

06/06/2013 

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.
Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
Learning the secrets of design for yield

06/04/2013 

Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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