Semiconductors

SEMICONDUCTORS ARTICLES



Vishay Intertechnology enhances precision thin film chip resistor arrays

05/16/2013 

Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.

Imec and Renesas collaborate on ultra-low power short range radios

05/16/2013 

Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.

Surface Cleaning and Preparation

05/16/2013 

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps.  An additional challenge is that the reduction in device size and an increase in device topography makes the removal of small particles even more challenging.

Silicon Valley foundry Noel Technologies adds advanced lithography services

05/16/2013 

Foundry hires former ASML’s Keith Best as director of photolithography; tasked with driving roadmap to 0.15 microns

EU announces achievements of three-year power microelectronics program

05/16/2013 

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.

UC Riverside scientists discover new uses for carbon nanotubes

05/15/2013 

The atom-sized world of carbon nanotubes holds great promise for a future demanding smaller and faster electronic components.

Global semiconductor sales outpace last year through Q1 of 2013

05/14/2013 

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

Chip Memory Technologies Inc. reveals unique embedded NV memory solution

05/14/2013 

Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.

HELIOS develops supply chain for integrating photonics with CMOS circuit

05/14/2013 

The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.

Studying 1/f noise

05/13/2013 

1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern ICs, but it has been used also as an important technique to characterize the manufacturing process quality.

TowerJazz and TLi Korea to collaborate on sensor ICs for mobile market

05/13/2013 

TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules.

IQE and II-VI Inc. launch 150mm GaN HEMT epi wafers on SiC substrates

05/13/2013 

IQE plc announces the launch of gallium nitride-based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates.

North American Semiconductor Industry: Continuing with high levels of investments

05/09/2013 

While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.

Top industrial electronics semiconductor suppliers suffer declining revenue in 2012

05/09/2013 

The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.

A new way to discover and monitor defects

05/09/2013 

In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.

First quarter 2013 reports slight decrease in silicon wafer shipments

05/09/2013 

Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

05/08/2013 

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.

SSDs to account for one-third of worldwide PC storage shipments by 2017

05/07/2013 

Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.

Intel launches low-power, high-performance microarchitecture

05/07/2013 

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.

LFoundry completes acquisition of Micron’s facility in Avezzano

05/06/2013 

LFoundry confirmed the signature of the final agreement regarding the acquisition of Avezzano (Italy) manufacturing facility.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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