05/06/2013 

Analog Devices, Inc. today announced the appointment of Vincent Roche as president and chief executive officer (CEO) and his election to the Board of Directors, effective immediately.

05/02/2013 

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.

05/01/2013 

DARPA's Near Junction Thermal Transport (NJTT) effort recently demonstrated the first-ever GaN-on-diamond high electron mobility transistor (HEMT).

04/30/2013 

The most popular storage medium this year for superthin Ultrabooks and similarly built laptops won’t be the pricey solid state drives (SSD) that initially created a buzz for their astonishing speeds.

04/30/2013 

University of Manchester researchers reported to Nature Communications that they have developed the first graphene-based transistor with bistable characteristics.

04/30/2013 

Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters. 

04/30/2013 

Spansion Inc. and Fujitsu Semiconductor Limited today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million for inventory.

04/30/2013 

Samsung Electronics Co., Ltd. today announced the industry’s first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20nm-class process node.

04/29/2013 

SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.

04/29/2013 

Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.

04/29/2013 

Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.

04/29/2013 

Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.

04/29/2013 

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

04/26/2013 

Renesas Electronics Corporation this week announced the development of the R2A25110KSP intelligent power device of isolated IGBT driver for use in electric and hybrid vehicle power inverters.

04/26/2013 

Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”

04/26/2013 

The global markets for digital power supplies and digital power integrated circuits (ICs) are projected to boom from 2013 to 2017, as their use in IT infrastructure increases and as the technology expands into lighting and consumer-oriented applications including PCs, appliances and cellphones.

04/26/2013 

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.

04/24/2013 

EPIC, the European Photonics Industry Consortium, has published a public database of more than 5000 company entries, an interactive map, and a report on the photonics ecosystem in Europe.

04/24/2013 

The market for GaN and SiC power semiconductors is set to rise by factor of 18 from 2012 to 2022.

04/24/2013 

Just as a boxer avoids a surprise shot to the head or torso by using a “duck and weave” maneuver, so to must front-end technologists confront the challenges associated with extending optical lithography while planning for EUV lithography’s eventual high-productivity solution.