08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

08/08/2018  Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China.

08/07/2018  The semiconductor industry today is faced with several substantial issues-not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows and decreasing product life cycles.

08/07/2018  Achronix Semiconductor Corporation today announced availability of an optimized High-Level Synthesis (HLS) flow from its partner, Mentor, a Siemens business, for its FPGA technology products.

08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

08/06/2018  UMC will offer cost effective licensing of embedded 28nm non-volatile MRAM macros to its foundry customers.

08/06/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

08/03/2018  A UCF physicist has discovered a new material that has the potential to become a building block in the new era of quantum materials, those that are composed of microscopically condensed matter and expected to change our development of technology.

08/03/2018  A new research report from Semico Research estimates that the semiconductor content for energy harvesting solutions will explode to $3.4 billion by 2022. 

08/03/2018  Entegris, Inc. today released the next generation EUV 1010 Reticle Pod for high-volume IC manufacturing using extreme ultraviolet (EUV) lithography.

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

08/02/2018  We’re living in a digital world where semiconductors have been taken for granted. But, Artificial Intelligence (AI) is changing everything – and bringing semiconductors back into the deserved spotlight.

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

08/01/2018  Hennessy, pioneer in electrical engineering, will accept 2018 Robert N. Noyce Award at SIA Award Dinner on Nov. 29.

08/01/2018  Toshiba Memory Corporation today announced that it consummated the merger with K. K. Pangea which is its parent company on August 1, 2018.

08/01/2018  Silicon-based system offers smaller, cheaper alternative to other 'broadband' filters; could improve a variety of photonic devices.

07/31/2018  Avnet, a global technology company, has been named a global distribution partner for Microsemi Corporation, a wholly owned subsidiary of Microchip Technology, Inc.

07/31/2018  SEMI today announced its support for calls yesterday by nearly 50 members of Congress for the Trump Administration to remove tariffs on U.S. semiconductor products imported from China.

07/31/2018  New packaging provides double-sided cooling for improved heat dissipation.

07/31/2018  Correlation coefficient expected to reach a very high level of 0.95 in the 2018-2022 timeframe.