03/05/2013 

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.

03/05/2013 

Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology

03/04/2013 

Samsung Vice-President Kwon Oh-hyun released a statement today, apologizing for the fatal hydrofluoric acid spill that left one worker dead and four others injured.

03/04/2013 

New 200 mm diameter wafer enhances photolithography capability.

03/04/2013 

Coherent, Inc. has expanded its family of industrial ultrafast lasers with the new Talisker 1000 series. This new series of high power picosecond lasers is designed for high-throughput, precision materials processing applications in the semiconductor, solar (photovoltaics), medical devices, consumer electronics and automotive industries.

03/04/2013 

Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).

03/04/2013 

Companies will develop integrated logic and Flash memory to enable creation of high-performance and low power electronics.

02/28/2013 

This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.

02/28/2013 

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.

02/27/2013 

Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform. The Kronos platform quickly produces accurate performance models for standard cells, I/Os, and complex cells within an advanced, integrated environment.

02/27/2013 

Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.

02/27/2013 

Transphorm Inc. today announced at the 2013 ARPA-E Energy Innovation Summit that its novel 600V Gallium Nitride (GaN) module has enabled the world’s first GaN-based high power converter. Transphorm will demonstrate the product built with its customer-partner Yaskawa Electric, Japan at the upcoming APEC 2013 industry conference.

02/27/2013 

Joe Kwan is the Product Marketing Manager for Calibre LFD and DFM Services at Mentor Graphics. He is also responsible for the management of Mentor’s Foundry Programs. He previously worked at VLSI Technology, COMPASS Design Automation, and Virtual Silicon. Joe received a BA in Computer Science from the University of California Berkeley and an MS in Electrical Engineering from Stanford University.

02/26/2013 

New marketing and technical support center opened in Reading, UK.

02/26/2013 

Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.

02/26/2013 

New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.

02/26/2013 

Molecular Imprints, Inc. (MII), a developer of advanced semiconductor lithography, has announced the delivery of an advanced lithography platform which uses Xaar 1001 inkjet printheads to pattern 450mm silicon wafer substrates.

02/26/2013  SEMATECH announced today that Dr. Bryan J. Rice, on assignment from Intel Corporation as SEMATECH’s director of Strategic Initiatives, was inducted as a 2013 Fellow by SPIE, the international society for optics and photonics, during its annual SPIE Advanced Lithography conferences in San Francisco, CA.

02/25/2013 

The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.

02/25/2013 

Luminescent Technologies Inc., a provider of computational metrology and inspection solutions for the global semiconductor manufacturing industry, and Dai Nippon Printing Company, Ltd. announced today the successful completion of the first phase of a three-year joint development program for computational metrology and inspection using Luminescent’s Automated Image Processing Hub (LAIPH) platform.