02/25/2013 

Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.

02/22/2013 

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.

02/21/2013 

At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.

02/21/2013 

Imec and Holst Centre presented at ISSCC an ultra-low power multi-standard 2.3/2.4GHz short range radio. The 1.9nJ/b radio is compliant with three wireless standards: Bluetooth Low Energy, ZigBee and Medical Body Area Networks.

02/21/2013 

Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.

02/20/2013 

New advancement enables the development of low-power, low-cost, high-data rate solutions for true mobile devices.

02/20/2013 

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.

02/20/2013 

Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.

02/20/2013 

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.

02/20/2013 

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.

02/20/2013 

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.

02/19/2013 

DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.

02/19/2013 

Yole Développement’s report provides an analysis of the emerging Non Volatile Memories (NVM) five applications fields that will fuel market growth and a description and forecasts of the four emerging NVM (MRAM, PCM, RRAM, FeRAM) technologies.

02/19/2013 

In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.

02/19/2013 

SPIE Advanced Lithography, the annual forum for discussions on state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration, will bring the community together in San Jose, California, next week to address those challenges.

02/19/2013 

Papers showcase EUV extendibility and metrology techniques for defect inspection and 3D TSVs.

02/18/2013 

Gigaphoton, Inc., a major lithography light source manufacturer, announced today that the company has achieved EUV light output equivalent to maximum of 20W for its laser-produced plasma, or LPP light sources for EUV lithography scanners.

02/18/2013 

Shimadzu Corporation today introduced the Tracera, a high-sensitivity gas chromatograph. Tracera is equipped with the newly developed barrier discharge ionization detector BID, which is capable of detecting all types of trace organic and inorganic compounds.

02/18/2013 

Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology, he says, brings more integration and performance.

02/15/2013 

Kevin Zhang, subcommittee chair of ISSCC, writes on the trends of memory devices for 2013 and beyond.