Semiconductors

SEMICONDUCTORS ARTICLES

Ultratech buys Cambridge Nanotech assets, adds ALD tech

12/20/2012

Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.

Asylum Research acquired by Oxford Instruments

12/19/2012

Abingdon, England--Oxford Instrumentshas acquired Asylum Research, a maker of scanning probe microscopes (SPM) with subsidiaries in the UK, Germany, and Taiwan. Its products are used by academic and industrial customers across the world for a wide range of materials and bioscience applications.

Singapore IME launches 2.5D silicon interposer MPW

12/19/2012

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.

Canon stepper targets LED, MEMS, power device manufacturing

12/18/2012

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.

Dreaming of plug-and-play IP

12/17/2012

Stephen Pateras, product marketing director for Mentor Graphics Silicon Test products, blogs about the new IJTAG standard, which enables "plug and play" automation for SoC design.

MEMS seeing strong growth in military sector

12/17/2012

Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.

Samsung reaffirms plans for $4B investment in Austin fab: What it means

12/17/2012

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.

Tezzaron licenses Ziptronix's bonding tech for 3D memory

12/17/2012

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.

Gartner reduces 2012-2013 chip outlooks, but 2014 looks better

12/14/2012

Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.

STMicro: 28nm FD-SOI is ready for manufacturing

12/12/2012

STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of (FD-SOI) technology with its partners.

#11: Fastest Ge p-MOSFET

12/11/2012

#10: Visualizing CBRAM Filaments

12/11/2012

#9: Record Silicon Nanowire MOSFETs

12/11/2012

#8: 300mm wafer-scale Ge FinFET

12/11/2012

#7: Hybrid Nanowire/CMOS Biosensor

12/11/2012

#6: Novel Nanopore Sensor for DNA Sequencing

12/11/2012

#5: Nanofluidic Channels for Lab-on-Chip

12/11/2012

#4: Monolithic 3D Chip

12/11/2012

#3: TSMCs Integrated 16nm FinFET Technology Platform

12/11/2012

#2: Thermally Stable Magnetic Tunnel Junction Memory

12/11/2012

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

SEMICONDUCTORS ARTICLES

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