Semiconductors

SEMICONDUCTORS ARTICLES



IBM demos high-performance CMOS on flexible plastic substrates

09/18/2012 

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

IEDM unveils 2012 program highlights

09/17/2012 

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

IBM gets sneak-peek at a molecule's bonds

09/17/2012 

IBM researchers have peered further inside a molecule's structure to distinguish the individual bonds, pointing the way to building an understanding of how graphene devices could work.

Using waste silicon to make Li-ion batteries

09/14/2012 

Researchers at Rice U. and the Université catholique de Louvain in Belgium have devised a method for converting discarded silicon into a key material for lithium-ion batteries.

iPhone 5: Which semiconductor suppliers are the big winners?

09/14/2012 

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.

Dow launches CMP polishing pad platform

09/14/2012 

Dow Electronic Materials introduced its new IKONIC polishing pad platform for chemical mechanical planarization (CMP).

NIST tips "hybrid" metrology method to test chips

09/13/2012 

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.

Samsung breaks ground on Chinese NAND fab

09/12/2012 

Samsung Electronics Co., Ltd. has held a groundbreaking ceremony for a new leading-edge NAND memory fab line in Xi'an, China, to be fully on line by 2014 making "10nm-class" process technologies.

Samsung breaks ground for memory manufacturing in China

09/12/2012 

Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.

Chip tool demand slumps in 2Q12, though Taiwan shines

09/12/2012 

Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.

GaAs nanowires on graphene focus of NTNU research

09/12/2012 

Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU)  have patented and are commercializing GaAs nanowires grown on graphene.

Scotch tape induces high-temp superconductivity

09/12/2012 

A team led by University of Toronto physicists has developed a simple new technique using Scotch poster tape that has enabled them to induce high-temperature superconductivity in a semiconducto.

SRC honors professors from UC Berkeley and MIT

09/12/2012 

Semiconductor Research Corporation (SRC) recognized two outstanding professors in SRC-supported, chip-related research and education for 2012.

Tablets, smartphones driving turnaround in power management chips

09/11/2012 

Demand for power management semiconductors recovered in 2Q12 after declining for half a year, thanks to strong demand from electronic products such as smartphones and media tablets, according to IHS iSuppli.

TSMC, UMC sales rise in August on customer pull-ins

09/11/2012 

Taiwan's two biggest semiconductor foundries saw sales jump in August, and business for the full third quarter is looking up as customers pull in some orders.

EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

09/10/2012 

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).

Nanya gets equity investment from ISSI, deepens ties across memory and analog

09/10/2012 

Taiwanese DRAM manufacturer Nanya Technology has received a $27M equity investment from a subsidiary of Integrated Silicon Solution to bolster the companies' foundry partnership.

Intel lowers 3Q outlook: What's the real driving factor?

09/07/2012 

Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.

Intel lowers 3Q outlook: What's the real driving factor?

09/07/2012 

Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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