09/07/2012 

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.

09/06/2012 

Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.

09/06/2012 

An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.

09/04/2012 

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.

08/31/2012 

Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.

08/31/2012 

US-based investment firm Kohlberg Kravis Roberts and Co. (KKR) reportedly is seeking to snap up struggling chip firm Renesas for ¥100 billion (US $1.3B)

08/30/2012 

Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).

08/30/2012 

Matheson has acquired a majority stake in RASIRC, supplementing its gas purification and material businesses with RASIRC's water vapor systems.

08/29/2012 

Bruce Kleinman, former VP of platform marketing at Xilinx, will now lead GlobalFoundries' product marketing efforts

08/29/2012 

Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30^th anniversary at its annual TECHCON conference Sept. 10-11.

08/28/2012 

FEI announced two new Helios NanoLab systems, the 450HP and 1200HP DualBeam systems, which include new capability that meets the critical requirements for semiconductor process development at the 28nmdevice geometry node and below.

08/28/2012 

Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.

08/27/2012 

SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.

08/27/2012 

Lithography leader ASML completes its Co-Investment Program, tallying €3.85 billion in equity funds and €1.38B to support R&D into EUV and 450mm.

08/24/2012 

TSMC joined IMS’s multibeam mask writer development collaboration to develop an electron multi-beam mask writer for use in advanced mask lithography applications, joining founding members DNP, Intel, and Photronics.

08/23/2012 

MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS₂). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.

08/23/2012 

The Global Semiconductor Alliance (GSA) released the global semiconductor funding, IPO, and M&A statistics for July 2012, noting a steep ramp from June, but small decline from July 2011.

08/23/2012 

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

08/23/2012 

Global semiconductor market revenue in Q2 2012 fell by 3% Y/Y to $75.2 billion, and grew sequentially <3%, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe, according to IHS.

08/22/2012