07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

07/23/2018  Scientists have perfected a technique to exceed capacity of current hard drives 1000-fold.

07/20/2018  Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

07/19/2018  A new theoretical study explains previous mystifying experimental results, in which coupled charged particles moved in exactly the opposite direction to that predicted. This apparently contradictory phenomenon is associated with the bandgap in dual-layer graphene structures, a bandgap which is very much smaller than in conventional semiconductors.

07/19/2018  New material draws heat away from hotspots much faster than current materials.

07/19/2018  Semi content to surpass 30% this year, smashing the previous record high set just last year.

07/18/2018  The board has named Rich Templeton, the company's chairman, to reassume the roles of president and CEO on an ongoing, indefinite basis, in addition to continuing as chairman.

07/17/2018  Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.

07/12/2018  Researchers from the University of Basel and IBM Research - Zurich have now developed a technique that allows electrical contact to individual molecules to be established.

07/12/2018  Gases and engineering company The Linde Group (Booth #5644 in the North hall) is investing in expansion of existing products to improve business continuity planning while adding new products with improved purity to meet the growing needs of sub-10nm semiconductor factories and advanced flat panel manufacturers

07/12/2018  To fulfill the promise of the Internet of Things (IoT), the world needs low-cost high-bandwidth radio-frequency (RF) chips for 5th-generation (5G) internet technology.

07/12/2018  The Mid-Year Update to the 2018 McClean Report revises IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in The 2018 McClean Report issued in January.

07/12/2018  Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.

07/11/2018  HEIDENHAIN announced the appointment of David Doyle as CEO of HEIDENHAIN CORPORATION, effective Oct. 1, 2018.  At that time, Doyle will assume full responsibility for the HEIDENHAIN CORPORATION customer-focused operations for the U.S., Canada and Mexico.

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.