Semiconductors

SEMICONDUCTORS ARTICLES



UMC’s “green” semiconductor fab in Taiwan certified LEED Gold

08/01/2012 

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) gained LEED-NC Gold recognition for its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, from the U.S. Green Building Council.

Crossing Automation intros Spartan sorter options

08/01/2012 

Crossing Automation, Inc. announced three new options for the Spartan 300 that deliver an end-to-end contamination-free sorter environment. The new options target high volume manufacturing at 32nm and below.

Gentry rejoins Seagate to lead SSD biz

07/31/2012 

Seagate Technology plc (NASDAQ:STX) added Gary Gentry to lead its solid state drive (SSD) business as senior vice president, SSD.

EDAX debuts SDD series for faster electron microscopy without lost data

07/31/2012 

EDAX Inc. introduced the Octane Series silicon drift detectors (SDD) for its TEAM EDS Analysis Systems on electron microscopes.

CGI Americas brings C Sun ovens to North American fabs

07/30/2012 

CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.

FEI’s extreme-high-resolution SEM enables metrology on semiconductors <22nm

07/30/2012 

FEI (NASDAQ:FEIC) launched the Verios XHR SEM for metrology on beam-sensitive and sub-nanometer-scale materials in advanced semiconductors.

Pfeiffer Vacuum intros gas analysis systems for 50 mbar and lower pressure processes

07/30/2012 

Pfeiffer Vacuum introduced the Sputter Process Monitor SPM 220 and High Pressure Analyzer HPA 220 gas analysis systems to monitor and document vacuum processes.

New cleaning system maintains contact cleaning rollers better than IPA

07/30/2012 

Teknek debuted an elastomer roller care system for all contact cleaning rollers. Unlike IPA cleaning, the elastomer Roller Doctor rejuvenation pad exfoliates the roller surface with a precise quantity of proprietary cleaning solution.

EMCORE switches fab management and process control to Camstar system

07/27/2012 

EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.

TI could struggle with semiconductor fab overcapacity til 2013

07/27/2012 

Texas Instruments Incorporated (TI, NASDAQ:TXN) announced Q2 2012 revenue of $3.34 billion, and expects Q3 to be about flat. Fab under-absorption charges will weigh on TI in Q3 and into Q4, analysts point out.

Printed electronics researchers in Europe install Optomec jet deposition tools

07/27/2012 

Optomec’s Aerosol Jet deposition tools are being used for printed sensor, display, solar cell, CMOS and passive devices, and other development areas, with new installations at CEA Liten (France), Innovation Lab (Germany) and the University of Sheffield (UK).

TI tops industrial electronics rankings, growing market share with NatSemi

07/26/2012 

Texas Instruments Inc. (TI) leads the fast-growing industrial electronics semiconductor market, growing its market share in 2011 in large part due to its acquisition of National Semiconductor, according to IHS.

Apple dominates semiconductor purchasing landscape

07/26/2012 

Apple Inc. is not only the world’s leading original equipment manufacturer (OEM) in terms of semiconductor purchasing, its also is increasing semiconductor buying at a faster rate than other top firms, reports IHS.

Analog IC manufacturing moves to 300mm; new growth applications arise

07/26/2012 

While communications make up the bulk of analog IC sales, growth is coming from automotive, energy, mobility, and medical/healthcare apps, according to Semico. This semiconductor sector is also moving to 300mm wafer production at smaller device nodes, which offers cost advantages.

AIXTRON debuts GaN-on-Si MOCVD reactor technology

07/26/2012 

AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.

GLOBALFOUNDRIES green-lights Fab 8 expansion

07/25/2012 

GLOBALFOUNDRIES will add 90,000 more square feet of semiconductor manufacturing space to Module 1 of Fab 8 in NY. The completed semiconductor manufacturing area will total 300,000sq.ft.

Micron must avoid integration pitfalls now that Elpida deal is done

07/25/2012 

Micron is more than doubling its DRAM manufacturing capacity by buying bankrupt Elpida Memory’s assets. But the move is “not without risk,” according to IHS.

ST expects MEMS growth in Q3, but cuts 2012 capex

07/25/2012 

In reporting its Q2 and H1 2012 results, STMicroelectronics (ST, NYSE:STM) said it will reduce its 2012 capex plan by about 25%, down to $500 million to $600 million.

Semiconductor foundry installs Mattson etch tool

07/25/2012 

Mattson Technology installed its paradigmE etch system at a major foundry, expanding the tool's customer base.

Toshiba cuts NAND Flash memory fab by 30%

07/24/2012 

One year after ramping Fab 5 at the site, Toshiba will reduce its NAND Flash memory semiconductor production at its Yokkaichi Operation fab in Mie Prefecture, Japan.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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