Semiconductors

SEMICONDUCTORS ARTICLES



Xilinx boosts silicon and electronics engineering in Ireland

07/05/2012 

Xilinx will invest $50 million to expand its electronics engineering operations, located at the company

Gigaphoton EUV lithography conversion efficiency tops semiconductor fab sector target

07/05/2012 

Gigaphoton Inc. reached a maximum of 5.2% EUV coversion efficiency (CE), beating the semiconductor manufacturing industry’s target of 5.0% for a first-generation EUV lithography scanner. These data show an average of 4.7% CE.

Picosecond laser enables new high-tech devices

07/05/2012 

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.

SIA recognizes semiconductor researchers, policy supporters

07/04/2012 

The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.

May semiconductor sales edge out April numbers for third growth month

07/04/2012 

“The upward trend of global semiconductor sales is encouraging,” said Brian Toohey, SIA. “Recent sales totals are in line with industry projections of modest growth for the remainder of 2012, but a sluggish global economy continues to provide substantial headwinds, limiting more robust growth.”

UMC licenses IBM’s 20nm, FinFET semiconductor technology

07/03/2012 

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors.

Qualcomm puts semiconductor business into new subsidiary QTI

07/03/2012 

Wireless technology company Qualcomm will change its corporate structure, moving substantially all of its R&D activities, its QCT semiconductor business, and other product and services businesses into a new wholly owned subsidiary, Qualcomm Technologies Inc.

Cypress secures credit from Morgan-Stanley-led group for acquisitions, other purposes

07/02/2012 

Cypress entered into a 5-year senior secured revolving credit facility with a group of lenders led by Morgan Stanley Senior Funding. The facility enables the company to borrow up to $430 million on a revolving basis.

EUVL workshop focuses on source power, timing

07/02/2012 

At the recently concluded 2012 EUVL Workshop (held June 4-8 in Maui, HI), attendees shared their latest technology developments and discussed ways to address the challenges of EUVL insertion into high-volume manufacturing (HVM).

Micron doubles wafer capacity, adds mobile DRAM with Elpida assets buy

07/02/2012 

Micron Technology Inc. (Nasdaq:MU) will acquire and support bankrupt DRAM maker Elpida Memory Inc.’s assets, paying approximately US$2.5 billion total consideration, less certain reorganization proceeding expenses.

SiC's advantages over silicon push more SiC semiconductors over 10 years

06/29/2012 

Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.

450mm semiconductor metrology tool to integrate IDE active vibration isolation

06/29/2012 

The IDE Group developed the STC series of Active Vibration Isolation Systems supporting OEMs in the production of 450mm wafer equipment.

Maxim plans major upgrades to US semiconductor fabs

06/29/2012 

Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.

ALD partnership enables surface functionalization of powders

06/29/2012 

Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.

JEDEC updates Flash memory standard for tablet/smartphone reqs

06/29/2012 

Microelectronics industry standards developer JEDEC Solid State Technology Association published key updates to its Universal Flash Storage (UFS) standard, specifically tailored for mobile applications and computing systems requiring high performance and low power consumption.

Productivity challenges identified during ISMI Manufacturing Week

06/28/2012 

Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.

Applied Materials targets 3D memory with new Avatar dielectric etch system

06/28/2012 

Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.

SEMICON West preview: Metrology, inspection, and process control products

06/28/2012 

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.

2012 “Best of West” award finalists announced

06/28/2012 

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.

DFMSim wins 1st metrology integration for its lithography software

06/28/2012 

DFMSim announced a distribution agreement with a leading US process control OEM that involves the integration of DFMSim’s SMARTlitho manufacturing software into new tools for advanced metrology.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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