06/05/2012 

Day 2 of The ConFab opened in Las Vegas with Ali Sebt, CEO of Renesas Electronics America, delivering “Smart Society, the Sensing Era and Signal Chain.”

06/05/2012 

Semiconductor manufacturing facilities dramatically decreased their normalized fab energy consumption from 1997 to 2011, shows ISMI's Worldwide Fab Energy Study.

06/05/2012 

Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.

06/05/2012 

W. L. Gore & Associates and CT Associates developed a method for measuring <50nm particles in ultra-pure water (UPW) used in semiconductor processes, and removing particles as small as 12nm, through a combination of ultrafiltration and microfiltration.

06/05/2012 

The 15^th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.

06/05/2012 

Jim Feldhan of Semico speaks with Solid State Technology editor-in-chief Pete Singer about expectations for the semiconductor industry and solid-state drives.

06/05/2012 

John Chen of Nvidia gave the opening keynote address of The ConFab 2012, presenting the concept of a “virtual IDM” comprising fabless companies, semiconductor foundries, and packaging houses working seamlessly together. After his speech, Chen caught up with Pete Singer.

06/04/2012 

Dan Hutcheson, VLSI Research Inc. spoke with Solid State Technology editor-in-chief Pete Singer at The ConFab 2012. Hutcheson presented on the cyclical nature of the semiconductor industry.

06/04/2012 

At The ConFab’s opening session, “The Economic Outlook for the Semiconductor Industry,” capex was a major point of interest. Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico all touched on it, with Hutcheson expanding on the idea of capex trends to present an entire ecosystem of semiconductor business management.

06/04/2012 

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.

06/04/2012 

The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.

06/04/2012 

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.

06/04/2012 

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.

06/04/2012 

Cymer presented at Barclays Capital’s TMT Conference, providing information on semiconductor makers’ transition from deep ultra violet (DUV) to extreme ultraviolet (EUV) lithography, pre-pulse technology demonstrations, and more.

06/01/2012 

A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.

05/31/2012 

Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.

05/31/2012 

Dr. Vivek Bakshi blogs about trends he expect to see at the upcoming 2012 International Workshop on EUV Lithography, in Maui Hawaii. 

05/31/2012 

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.

05/31/2012 

Picosun Oy delivered a second PICOSUN ALD tool to Uppsala University’s Ångström Laboratory in Sweden for work on surface treatment of carbon nanostructures, transition metal and compound semiconductor thin film manufacturing, and ultrathin polymer layer deposition on various substrates.

05/30/2012 

Element Six, maker of synthetic diamond supermaterials, opened its first US manufacturing facility in Silicon Valley, housing production, technical, and customer service.