Semiconductors

SEMICONDUCTORS ARTICLES



Researchers model ion bombardment for better nanofabrication

05/23/2012 

Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.

Indium expands electronics materials manufacturing with new facility in NY

05/23/2012 

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.

Present at IEEE IEDM 2012

05/23/2012 

IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.

Power discrete semiconductors grow with cloud computing, electric vehicle demand

05/22/2012 

Power discretes’ sales revenue will grow at a CAGR of 6.5%, 2012-2016, estimates GBI Research. Power discretes are meeting demand for energy-efficient and environmentally friendly products.

IRSC brings NanoProfessor nano-science education to southeastern US

05/22/2012 

Indian River State College in FL will be the first college in the southeastern US to offer students access to the instrumentation and curriculum provided by the NanoProfessor Nanoscience Education Program from NanoInk.

EUV lithography readiness: ConFab presentation preview

05/21/2012 

Stefan Wurm, director of lithography, SEMATECH will present “EUV Lithography Manufacturing Introduction: Infrastructure Readiness” in the session Technology Trends in Semiconductor Manufacturing at The ConFab 2012, June 3-6 in Las Vegas.

ONNN opens IC design center in Czech Republic

05/21/2012 

ON Semiconductor (Nasdaq:ONNN) expanded its Roznov, Czech Republic, operations with a new 4,000sq.m. research and design facility, a quarter of which is high-tech laboratories.

Low-cost Flash memory boosted by gray-market cellphones

05/21/2012 

The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS.

Bridging the fabless-foundry gap: Highlighted ConFab presentation

05/18/2012 

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”

Lower DRAM prices enable more DRAM per smartphone without higher pricetag

05/18/2012 

DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS.

Capex expectations update for TSMC, GLOBALFOUNDRIES, SMIC, UMC, more

05/18/2012 

Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali.

SEMICON West preview: Conference keynotes and "Extreme Electronics"

05/18/2012 

SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.

JEDEC publishes LPDDR3 standard for low-power memory chips

05/17/2012 

JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices.

Semiconductor companies see increased venture capital funding in April

05/17/2012 

In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance (GSA).

Tight 28nm supply shifts GPU maker shares in Q1

05/17/2012 

Barclays Capital’s C.J. Muse looks at the forecast for PC GPUs based on a new report from Mercury Research. Shipments of PC graphic devices in Q1 2012 came in in-line to slightly below historical trends. Nvidia lost share to Intel and AMD due to tight 28nm chip supply.

Gigaphoton opens Korean subsidiary for DUV, EUV lithography support

05/16/2012 

Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important regions in the global semiconductor industry.”

Microsoft joins Hybrid Memory Cube Consortium

05/16/2012 

The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium.

SMIC expands Beijing fab for smaller-node semiconductor manufacturing

05/15/2012 

Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab.

Buhler approved to acquire Leybold Optics

05/15/2012 

Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.

SUSS MicroTec takes over SUSS MicroOptics

05/15/2012 

SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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