Semiconductors

SEMICONDUCTORS ARTICLES



DRAM partially recovers thanks to Elpida bankruptcy

05/15/2012 

The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.

Infineon CEO Bauer resigns for health considerations

05/15/2012 

Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.

Chinese GaAs foundry installs SPTS PVD tool

05/15/2012 

SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.

Advantest DRAM test system clocks 8Gbps test speed on every pin

05/14/2012 

Advantest Corporation uncrated the next-generation high-speed DRAM test system, T5511, offering 8Gbps test speed. It can be deployed from R&D through to volume production.

GLOBALFOUNDRIES joins top-20 semiconductor suppliers in Q1 2012 on Elpida bankruptcy

05/14/2012 

The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLOBALFOUNDRIES replaced bankrupt Elpida on the top 20 charts.

Semiconductor-grade flow sensor measures photoresist, solvent supply

05/14/2012 

SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.

Nanostructured polymer lithography platform established by CEA-Leti and Arkema

05/11/2012 

Arkema and CEA-Leti, with the help of Professor Hadziioannou’s team of LCPO, have successfully patterned a 20nm pitch and reduced the diameter of contacts down to 7nm with nanostructured polymers.

Precision spray coater builds coatings through layer-by-layer self assembly

05/11/2012 

Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL) self-assembly.

CMOS image sensor suppliers ramp up 300mm capacity

05/11/2012 

CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.

Intel (INTC) plans high capex and fast node shrinks, expects chipmaker consolidation

05/11/2012 

At Intel’s annual investor day, the chipmaker reported that capital spending will be high in 2012 and 2013, noting that its 22nm and 14nm node capabilities are differentiators. Intel focused on its Ultrabook launches, consolidation in the chip industry, and reiterated that capex is for internal use not foundry services.

Micron confirms Elpida takeover discussions

05/11/2012 

Memory chip maker Micron Technology Inc. (Nasdaq:MU) confirmed that it is engaged in discussions to take over the assets of bankrupt DRAM maker Elpida Memory Inc.

Astro Pak expands precision cleaning cleanrooms in CA

05/10/2012 

Astro Pak Corporation opened its Class 100 and Class 1000 cleanrooms, recently renovated and expanded, in Downey, CA. The cleanrooms host contract precision cleaning for the semiconductor manufacturing, aerospace, and other industries.

Dow Corning orders AIXTRON epitaxy reactors for power electronics fab

05/10/2012 

Dow Corning will add 2 AIXTRON AIX 2800G4 WW planetary reactor platforms to its silicon carbide (SiC) epitaxy capacity for next-generation power electronics.

SEMI adds Brewer, Mitchell to North American Advisory Board

05/09/2012 

EMI added two members its North American Advisory Board: Terry Brewer of Brewer Science and Wayne Mitchell of Air Products.

SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

05/09/2012 

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.

Coherent achieves ISO/IEC 17025 certification at laser calibration lab

05/09/2012 

Coherent Inc., supplier of laser power and energy management instruments, achieved a certificate of accreditation to ISO/IEC 17025:2005 at its Wilsonville, OR calibration laboratory.

UNL taps SEMI-GAS for semiconductor metrology lab’s gas needs

05/08/2012 

SEMI-GAS Systems, ultra-high-purity gas source and distribution system maker, will outfit the University of Nebraska - Lincoln’s new Nanoscience Metrology Facility. Applied Energy Systems will provide field services.

AIXTRON MOCVD tool installed for GaN research at U of Warsaw

05/08/2012 

University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.

Silicon wafer shipments up sequentially, down 11% Y/Y in Q1 2012

05/08/2012 

Worldwide silicon wafer area shipments increased slightly during Q1 2012 when compared to Q4 2011 area shipments, according to SEMI. Wafer shipments fell 11% from Q1 2011.

President Obama speaks at Albany Nano-Tech Complex today

05/08/2012 

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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