Semiconductors

SEMICONDUCTORS ARTICLES


Logic fab orders MTSN rapid thermal anneal for volume ramp

04/30/2012 

A leading semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier, for a Millios millisecond annealing system (MSA).
MEI semiconductor wet process tools built to prevent contamination

04/27/2012 

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
Qualcomm dominates cellular baseband chip market in 2011

04/26/2012 

The global cellular baseband processor market grew 15% year-on-year in 2011, hitting $15.1 billion, shows Strategy Analytics. Of that, Qualcomm holds 45% market share.
SEMATECH highlights from VLSI-TSA

04/26/2012 

SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).
Vistec delivers electron-beam lithography system to ITME researchers in Poland

04/26/2012 

Vistec Electron Beam GmbH sold a Variable Shaped Beam system SB251 to the Institute of Electronic Materials Technology in Warsaw, Poland, for R&D on micro-optical and diffractive elements, new materials, and masks for optical lithography.
TSMC raises capex more than expected

04/26/2012 

Due to stronger demand for TSMC’s 28nm technology and the pull-in of a 20nm R&D process line, the foundry raised its estimate for 2012 capital expenditures from $6 billion to $8-8.5 billion.
Understanding semiconductor wafer demand growth in 2012

04/25/2012 

Wafer demand grows at a CAGR of about 8-9%, but capital investment in wafer fab capacity does not stick with an 8-10% investment rate every year. Semico tracks wafer demand, which is “anything but stable.”
Semiconductor makers spend most on cleanroom hardware in 2012

04/25/2012 

As semiconductor nodes shrink, filter manufacturers and cleanroom designers must offer products that remove the smallest possible particles. While hardware can accomplish much of this, the cleanliness of a room is a function of the motion of the employees in the room.
2012 semiconductor revenue forecast bumped up 1 point at IHS

04/25/2012 

The overall semiconductor industry will grow 4.3% in 2012, according to IHS, which raised its forecast 1 percentage point based on consumer demand for wireless products like smartphones and tablets.
Major semiconductor makers order EUV lithography metrology tool from Carl Zeiss

04/25/2012 

Carl Zeiss won orders for its EUVL actinic aerial image metrology system, AIMS EUV, from 2 of the 4 members of SEMATECH’s EMI partnership. The tool allows chip makers to review defects in advanced masks needed for EUVL.
Texas Instruments (TI, TXN) reports broad orders increase in Q1 2012

04/24/2012 

"As we expected, our business cycle bottomed in the first quarter, and early signs of growth began to emerge." -- Rich Templeton, TI's chairman, president and CEO.
SEMATECH adds Inpria resists to EUV lithography work

04/24/2012 

Inpria, chemical materials supplier for thin-film deposition, joined the consortium SEMATECH’s Lithography Program. Inpria and SEMATECH will tackle on critical issues for resist in extreme ultraviolet (EUV) lithography.
Intel’s first 22nm trigate transistor products debut

04/24/2012 

Intel Corporation introduced its first product built on the 22nm 3D trigate transistor: the quad-core 3rd-generation Intel Core processor family for desktop, laptop and all-in-one (AIO) designs.
AMD Q1 shows steady improvement, 28nm readiness, heavy competition

04/24/2012 

AMD (NYSE:AMD) announced Q1 2012 revenue of $1.59 billion, a net loss of $590 million and operating loss of $580 million. Analysts share their takes on AMD's 32nm and 28nm situation, ASPs, and more.
Qualcomm’s first 28nm semiconductor outperforms 45nm siblings by 25%

04/24/2012 

The HTC One S HSPA phone runs Android 4.0.3, based on Qualcomm’s first 28nm processor, the MSM8260A, with an Adreno 225 GPU core. ABI Research performed a teardown on the handset.
Toshiba builds semiconductor fab in Thailand to replace flooded fab

04/24/2012 

Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.
KLA-Tencor wafer defect/metrology cluster tool monitors all wafer surfaces in parallel

04/23/2012 

KLA-Tencor Corporation (NASDAQ:KLAC) debuted the CIRCL suite high-throughput defect inspection/metrology/review system for implementation at lithography, outgoing quality control (OQC) and other process modules in semiconductor manufacturing lines.
Freescale Semiconductor CEO plans retirement, seeks successor

04/23/2012 

Freescale Semiconductor Holdings (NYSE:FSL) launched a formal process to identify a successor to Chairman and CEO Rich Beyer, who will retire as CEO after a transition.
Metrology tool offers economical price point with high accuracy

04/23/2012 

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.
Semiconductor subsystems see record revenues thanks to 32nm and below

04/23/2012 

Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch. 




WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts