Semiconductors

SEMICONDUCTORS ARTICLES



Semiconductor investments from venture capital sector fall in March

04/23/2012 

Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).

IBM adds membrane, chemical suppliers to lithium-air battery project

04/23/2012 

IBM welcomed Asahi Kasei and Central Glass to its Battery 500 Project team, collaborating on far-reaching research to improve electric vehicles. Asahi Kasei will engineer membrane technologies and Central Glass will develop electrolytes and additives for lithium-air batteries.

MOCVD and MBE epitaxy trends for compound semiconductors

04/20/2012 

The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.

Multi-core semiconductor scaling enabled with memory communication research

04/20/2012 

Researchers sponsored by Semiconductor Research Corporation have identified a path to overcome challenges for scaling multi-core semiconductors by addressing how to scale memory communications among the cores.

North American semiconductor fab tool makers see March book-to-bill hike

04/20/2012 

With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.

NAND flash memory sees steady growth thanks to ultrabooks, smartphones, tablets

04/19/2012 

The NAND flash memory market will grow 8% in 2012 to $22.9 billion, thanks to major sales drivers such as solid-state-drive (SSD) equipped ultrabooks, according to the IHS iSuppli Data Flash Market Tracker.

Intel’s Q1 2012 earnings: Key takeaways

04/19/2012 

Intel Corporation (NASDAQ:INTC) posted quarterly revenue of $12.9 billion, operating income of $3.8 billion, and net income of $2.7 billion. Analysts from FBR Capital Markets and Barclays Capital break down the numbers.

EPIC names new director general, promises closer ties with EU

04/19/2012 

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.

Ultratech brings former member back to Board

04/19/2012 

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech

Texas Instruments (TI, TXN) names top suppliers

04/19/2012 

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.

ASMC will focus on productivity and technology challenges

04/18/2012 

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

Soitec's fully depleted (FD) semiconductor product roadmap

04/17/2012 

Soitec, semiconductor materials supplier, released its fully depleted product roadmap, comprising two products designed for both planar and three-dimensional approaches to building semiconductor transistors.

Laser lithography tool uses piezo stage to construct submicron features

04/17/2012 

The new laser lithography tool from Nanoscribe GmbH produces complex 3D submicron structures up to 1mm with 150nm widths, boasting full automation and precise repeatability. It is based on a 3-axis piezo nano-positioning stage from PI (Physik Instrumente).

Top 10 semiconductor vendors: Intel broadens lead, Qualcomm sees most growth

04/17/2012 

Total worldwide semiconductor revenue reached $306.8 billion in 2011, up $5.4 billion, or 1.8% from 2010, according to Gartner Inc.

Thinned compound semiconductor wafer handling enabled by 3 Brewer Science tools

04/17/2012 

Brewer Science released new wafer processing equipment for thin wafer separation and post-debond cleaning during compound semiconductor device processing: a thermal debonder, separation tool, and megasonic cleaning system.

Lithography tool buying increases on logic and chip foundry demand

04/16/2012 

Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased, as foundries are seeing high demand for 28nm chips.

Electron-beam lithography breakthroughs at Photomask Japan

04/16/2012 

The eBeam Initiative will present at Photomask Japan (PMJ), through member companies, improved photomask critical dimension uniformity (CDU) and wafer yields thanks to eBeam technologies.

Veeco ion beam deposition tool matches PVD speed

04/16/2012 

Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.

Conference Report: MRS Spring 2012, Day 5

04/16/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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