Semiconductors

SEMICONDUCTORS ARTICLES



Conference Report: MRS Spring 2012, Day 4

04/13/2012 

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.

Chip sector sets up for high demand in H2

04/13/2012 

Barclays Capital and FBR Capital Markets share their takes on earnings season for public semiconductor companies. Both predict a cycle of inventory replenishment in the semiconductor supply chain that will bode well for chip makers in 2012.

JEDEC taps Nokia, Micron, Samsung Semiconductor for non-volatile wireless memory subcommittee

04/13/2012 

JEDEC Solid State Technology Association will form a subcommittee to its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards focused on standardization of non-volatile memory (NVM) in wireless applications.

Intel awards 9 elite suppliers in 2011

04/13/2012 

Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.

Sony restructures to boost leading-edge display, electronics products

04/13/2012 

Sony Corporation will implement series of initiatives, under its new management team, to “revitalize and grow the electronics business to generate new value, while further strengthening the stable business foundations of the Entertainment and Financial Service businesses.”

Entegris builds advanced filtration and contamination control R&D center for 2X, 1X semiconductor fab

04/12/2012 

Entegris (NASDAQ:ENTG), contamination control and handling system supplier to the semiconductor and microelectronics industries, will build the Entegris i2M Center for Advanced Materials Science in Bedford, MA, near its headquarters in Billerica. i2M denotes ideas to market.

Intel, Xilinx fund chip design software company Oasys

04/12/2012 

Oasys Design Systems added Intel Capital and Xilinx to its investors in a Series B round. Oasys will use the funds to expand R&D and build a global support structure.

Graphene grown on 300mm wafers with AIXTRON tool in Japan

04/12/2012 

The National Institute of Advanced Industrial Science and Technology in Japan is using its AIXTRON SE BM 300 system to grow monolayer graphene on 300mm wafers.

Top 25 fabless IC companies in 2011

04/12/2012 

The top 25 fabless IC suppliers captured 80% of a total $64.9 billion fabless IC market in 2011, according to IC Insights. Sales topped $1 billion at 12 fabless companies; Qualcomm topped the list with nearly $10 billion in sales. US-based suppliers captured 8 of the top 10 rankings.

Conference Report: MRS Spring 2012, Day 3

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Economy, fabless relationships, 450mm and more on deck at The ConFab 2012

04/12/2012 

The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.

Intel’s top suppliers in 2011

04/12/2012 

Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.

SEMI educates policymakers on 450mm transition

04/11/2012 

This SEMI News and Views blog, written by Jonathan Davis, president, SEMI Semiconductor Business, covers SEMI's efforts with government and policy-shapers in the US and Europe.

Semiconductor foundries expect double-digit growth through 2015

04/11/2012 

The pure-play semiconductor foundry business will ride the growth of tablets, ultrabooks, and smartphones to $29.6 billion in revenues, according to an IHS iSuppli Semiconductor Manufacturing and Supply Market Tracker report.

Conference report: MRS Spring 2012, Day 2

04/11/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.

Vacuum pumps improve throughput by 90% with new rotary design

04/10/2012 

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.

Attend joint sessions at VLSI Technology and Circuits

04/10/2012 

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

SEMATECH, centrotherm’s semiconductor-fab subsidiary partner on low-temp processes

04/10/2012 

centrotherm thermal solutions, a semiconductor-manufacturing-focused subsidiary of centrotherm photovoltaics AG, joined the SEMATECH Front End Processes (FEP) program, and will work with SEMATECH to develop low-temperature processing techniques for next-generation logic and memory devices.

SMIC doubles guidance on improved semiconductor wafer fab utilization

04/10/2012 

Semiconductor Manufacturing International Corporation (SMIC, NYSE:SMI, SEHK:981) revised upward its first quarter revenue and gross margin guidance for the three months ended March 31, 2012.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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