Semiconductors

SEMICONDUCTORS ARTICLES



Conference Report: MRS Spring 2012, Day 1

04/10/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco, describing recent work with graphene, organic electrochemical transistors, pentacene organic TFTs, and functional inks made of CNTs and other nanomaterials.

Semiconductor wafer fab equipment trends

04/10/2012 

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.

Semiconductor wafer fab equipment trends: Test

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.

Semiconductor wafer fab equipment trends: Process control/Metrology

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse considers the rebound in process control due to weak yields at smaller chip nodes.

Semiconductor wafer fab equipment trends: Deposition

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse separates the rising and declining styles of deposition.

TSMC begins Fab 14 expansion for 20nm-node semiconductors

04/09/2012 

TSMC (TWSE: 2330, NYSE:TSM) began Phase 5 of its Fab 14 GigaFab at the South Taiwan Science Park in Tainan, planned to be a “key production center” for advanced 20nm semiconductor chips.

Coventor boosts predictive process modeling for advanced device nodes

04/09/2012 

Coventor launched SEMulator3D 2012, featuring improved predictive process modeling tools with increased capacity, speed, and automation for leading-edge process technology nodes.

Semiconductor wafer fab equipment trends: Wafer clean

04/09/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at trends in wafer cleaning, such as single wafer and bevel clean.

Semiconductor wafer fab equipment trends: Etch

04/09/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse explains changes at the etch step.

Semiconductor wafer fab equipment trends: Ion implant

04/09/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by step. Barclays looks at the possibilities for ion implant.

Semiconductor wafer fab equipment trends: Lithography

04/09/2012 

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment spending, with a look at the top players and underlying trends by process step. Here, Barclays’ CJ Muse considers lithography’s current state and future.

Wafer fab equipment leaders in 2011 and expectations for 2012

04/09/2012 

Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.

Elpida bidders and the future mobile DRAM landscape

04/09/2012 

Since Elpida Memory filed for bankruptcy protection, reported bidders have included Micron, Hynix, and Toshiba, and now private equity firms TPG Capital and Hony Capital. CJ Muse of Barclay Capital shares the likely and unlikely scenarios for Elpida, and how these will affect DRAM overall.

ADI names top suppliers

04/09/2012 

Analog Devices Inc. (NASDAQ:ADI) honored 14 companies with the 11th Annual “Supplier Excellence Awards,” selected from among the more than 2,000 companies that contribute to ADI’s global semiconductor manufacturing operations.

EUV lithography optics on order at Zygo

04/09/2012 

The Optical Systems Division of Zygo Corporation recorded a $2+ million order from a major semiconductor manufacturer to produce EUV optics for advanced lithography.

Tanaka Precious Metals platinum electrode enables ozone-based semiconductor cleaning

04/09/2012 

Tanaka Kikinzoku Kogyo K.K. developed a platinum electrode that produces ozone solution at 40x the efficiency of existing technology.

HDD industry hits reset on prices, markets, technologies post-floods

04/09/2012 

 

Worldwide HDD unit shipments experienced a year-over-year decline of 4.5% in 2011. Efforts to clean and repair flooded HDD factory buildings and equipment will take most of H1 2012. HDD and HDD component production should return to pre-flood output levels in H2, reports IDC.

Top 25 semiconductor company rankings reveal big winners, big losers

04/05/2012 

The top 10 and top 25 semiconductor suppliers registered 7% and 4% growth, respectively. However, 15 of the top 25 semiconductor sales leaders posted negative results in 2011. Only 9 of the top 25 suppliers outperformed the total worldwide semiconductor industry 2011/2010 growth rate.

Intel 22nm trigate transistor process chosen for next-gen Netronome flow processors

04/05/2012 

Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processors (NFP) using Intel’s 22nm tri-gate transistor architecture.

Power electronics grow on SiC and GaN innovation

04/05/2012 

Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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