03/28/2012 

Strong demand for MEMS sensors, CMOS image sensors, LEDs, fiber-optic laser transmitters, and power transistors enabled the OSD semiconductors market to grow by 8% in 2011, hitting a new record revenue and beating out the overall IC market, according to IC Insights.

03/27/2012 

Himax Technologies placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.

03/27/2012 

03/26/2012 

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.

03/26/2012 

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.

03/26/2012 

Micronova Nanofabrication Centre selected a Vistec Lithography e-beam litho system for its nanotechnology laboratory in Finland. The litho tool will be used for nanoelectronics, nanofabrication, microelectronics, nanophotonics and microfabrication research in a multi-user environment.

03/26/2012 

Hynix officially became a member of SK group, energy and telecommunications conglomerate, changing its name to SK Hynix.

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

03/23/2012 

Elpida's bankruptcy process moved forward another step, with the Tokyo District Court naming Yukio Sakamoto, Elpida president & CEO and Nobuaki Kobayashi, attorney-at-law as the Trustees for the case.

03/23/2012 

North America-based makers of semiconductor equipment posted $1.33 billion in orders in February 2012, $1.32 billion in billings, and a book-to-bill ratio of 1.01, according to SEMI.

03/22/2012 

GLOBALFOUNDRIES' Fab 1 in Dresden, Germany has shipped 250,000 semiconductor wafers based on 32nm HKMG technology. AMD commented that it will move ahead with 28nm at GLOBALFOUNDRIES.

03/22/2012 

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.

03/22/2012 

Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.

03/22/2012 

Lithography light source maker Gigaphoton Inc. opened its new U.S. Regional Headquarters and Training Center in Beaverton, OR.

03/22/2012 

Gudeng Precision will use VICTREX PEEK-ESD 101 to make its first commercialized extreme ultraviolet (EUV) lithography pod. The material will help prevent contamination.

03/21/2012 

Dow Electronic Materials released KLEBOSOL II 1730 colloidal silica slurry for CMP of inter-layer dielectrics and post-metal buff.

03/21/2012 

Semiconductor days of inventory rose 3.4%, hitting an 11-year high of 84.1 DOI at chip suppliers in Q4 2011, but this will decline 0.5% in Q1 2012, with hopes that demand is improving, says IHS.

03/21/2012 

ASIC design starts are evolving under increasing design costs, rising design complexity, and lengthening design cycle times, especially in the SoC market, says Semico Research Corp. New applications are providing an element of stability.

03/21/2012 

Barclays Capital weighs in on rumors that Micron (MU) offered $1.5 billion to take over Elpida. Should the offer stand, it would be about 20-30 cents on the dollar for Elpida's assets.

03/21/2012 

Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.