03/15/2012 

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

03/15/2012 

SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.

03/15/2012 

As products using gallium nitride (GaN) technology continue to gain acceptance in military and commercial applications, development activities at microelectronics companies are accelerating.

03/14/2012 

TI opened a CA-based research lab for analog and mixed-signal circuits, tapping into local universities for a portion of the research. SMIC is teaming with Brite Semiconductor and Zhejiang University for an IC research program in China. Both aim to develop a "home-grown" and dynamic semiconductor industry workforce.

03/14/2012 

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.

03/14/2012 

Japan's NAND flash memory supplier Toshiba rapidly rebounded from the devastating Great East Japan earthquake and tsunami that hit one year ago this week, says IHS, thanks to fortunate fab location, quick wafer supply replenishment, and strong demand.

03/14/2012 

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.

03/13/2012 

Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.

03/13/2012 

SemiSouth Laboratories Inc., high-voltage silicon-carbide (SiC) semiconductor device manufacturer, launched its second major capacity expansion within 18 months.

03/13/2012 

RASIRC determined that a new wet thermal oxidation process on a RASIRC Steamer enables 87% better wafer throughput than dry oxidation of uniform thin oxides.

03/13/2012 

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.

03/13/2012 

Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.

03/12/2012 

The Global Semiconductor Alliance (GSA), global semiconductor industry association, appointed Ajit Manocha, CEO of GLOBALFOUNDRIES, to its board of directors. 

03/12/2012 

03/12/2012 

ST-Ericsson, wireless and semiconductor company, selected planar fully depleted silicon on insulator (FD-SOI) technology from Soitec for use in future mobile platforms.

03/12/2012 

Nova Measuring Instruments Ltd. (NASDAQ:NVMI) received $12 million in orders from leading semiconductor foundries for metrology on 2Xnm manufacturing ramp ups.

03/09/2012 

Fraunhofer Center Nanoelectronic Technologies is collaborating with bubbles & beyond to jointly develop novel cleaning solutions for the microelectronics industry, specifically, removing lithographic materials from semiconductor wafers.

03/09/2012 

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

03/09/2012 

Siltronic, subsidiary of Wacker Chemie AG, will stop producing 150mm silicon wafers at its Portland, OR, facility in Fall 2012, and will consolidate 150mm production at its Burghausen, Germany, site.

03/09/2012 

IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.