Semiconductors

SEMICONDUCTORS ARTICLES



Confovis taps Digital Surf for metrology tool imaging software

03/09/2012 

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

Semiconductors swayed by US presidential elections

03/08/2012 

Historically, US presidential election years have been very good for the semiconductor market as many elected officials attempt to pass (mostly short-term) legislation to boost the economy, reports IC Insights.

Micro-optics formed with halftone gel lithography, bio inspiration

03/08/2012 

Researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply, to aid advances in biomedicine, robotics and tunable micro-optics.

HDD recovers rapidly from Thailand floods and sluggish market

03/08/2012 

The HDD industry is rapidly recovering in 2012 and beyond, after surviving natural disasters and tepid market conditions in 2011, according to a report by TRENDFOCUS.

Photomask maker Photronics buys out Micron building

03/07/2012 

Photronics, Inc. (NASDAQ:PLAB) purchased its US nanoFab building from Micron Technology Inc., paying approximately $35 million. PLAB expects to save $5 million annually after the deal.

SINGULUS sells vacuum deposition tools to semiconductor sector

03/07/2012 

Singulus Technologies Aktiengesellschaft (SINGULUS) received 2 orders for its TIMARIS vacuum deposition system from the semiconductor industry.

Nitrogen-rich indium nitride wafers debut from Meaglow

03/07/2012 

Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.

LED makers could diversify with GaN power electronics production

03/07/2012 

The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.

NCSU researchers create functional oxide films

03/07/2012 

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.

German semiconductor maker revamps DUV lithography steppers with Ventex

03/07/2012 

Ventex performed a major deep ultra violet (DUV) lithography stepper refurbishment and installation project for a tier-one chip manufacturer in Germany.

Automated film frame handlers increase LED and semiconductor production

03/06/2012 

Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.

imec unveils 14nm PDK, 14nm test chip to follow

03/06/2012 

Imec has released an early-version process development kit (PDK) for 14nm logic chips, targeting the introduction of numerous new key technologies, such as FinFET architectures and EUV lithography.

Semiconductor fab equipment spending to hit a record in 2013

03/06/2012 

Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.

GaN transistors commercially available from HRL

03/05/2012 

HRL Laboratories LLC will now offer products in its GaN high electron mobility transistor (HEMT) technology commercially to customers in select markets, such as high-data-rate wireless links, radars and active sensors.

TSMC establishes 3 COOs under CEO Chang

03/05/2012 

TSMC (NYSE:TSM) named 3 co-chief operating officers at a special meeting of the foundry's Board of Directors. All three executives will report directly to Chairman and CEO Dr. Morris Chang.

Semiconductor demand declines 8.8% to start 2012, but expect positive drivers

03/05/2012 

The SIA reports worldwide semiconductor sales of $23.1 billion in January 2012, an 8.8% decrease year-over-year, but SIA expects positive demand as 2012 progresses.

AMD's new GLOBALFOUNDRIES semiconductor wafer agreement frees up 28nm choices

03/05/2012 

AMD (NYSE:AMD) amended its wafer supply agreement with GLOBALFOUNDRIES. The new agreement most notably gives AMD "flexibility to manufacture 28nm parts elsewhere," reports FBR Capital Markets.

TSMC, Samsung foundries reconsidering 2012 capex on stronger 28nm demand

03/05/2012 

After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.

Metrology project launches in Europe for thin films

03/02/2012 

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.

ISSCC from a memory analyst’s view

03/02/2012 

The International Solid State Circuits Conference (ISSCC) brought the best and brightest minds in semiconductors together to share the results of the past year’s research and development efforts. Memory analyst Jim Handy, Objective Analysis, was there to cover some highly interesting presentations.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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