Semiconductors

SEMICONDUCTORS ARTICLES



Elpida begins reorganization in Tokyo court: Analysts weigh in

03/02/2012 

Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings

EVG wafer clean tool installed at Tokyo Institute of Technology

03/01/2012 

EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.

DuPont sells CMP JV interests to Air Products

03/01/2012 

Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.

HDD rankings: Seagate ousts Western Digital after Thailand floods

02/29/2012 

Seagate recaptured the lead in HDD shipments during Q4 2011, ousting Western Digital thanks to "a fortuitous accident in geography" that kept Seagate's Thailand HDD manufacturing plant out of the floods last year, said IHS.

Nanolab Technologies doubles space for IC analysis services

02/29/2012 

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.

Infineon adds to semiconductor manufacturing complex in Malaysia

02/29/2012 

M+W Group, a global engineering and construction company, is reporting a major contract from Infineon Technologies for a new 100,000-sq.m. semiconductor plant in Kulim/Malaysia.

GLOBALFOUNDRIES hires procurement exec to manage capex expansions

02/29/2012 

GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.

IBM sets quantum bit (qubit) error reduction records

02/29/2012 

IBM Research established new records for reducing errors in elementary computations and retaining the integrity of quantum mechanical properties in qubits for quantum computing, using superconducting qubits.

Intel (INTC), Micron (MU) expand NAND flash memory JV

02/29/2012 

Intel Corporation and Micron Technology, Inc., entered into agreements to expand their NAND Flash memory joint venture relationship, wherein Intel will sell its stake in 2 fabs to Micron, IMFS and IMFT.

Antenna and RF silicon design work: imec and HiSilicon, Agilent and OSAT Company partner

02/28/2012 

HiSilicon and imec have signed a strategic research collaboration to develop innovative RF transceiver architectures for next-generation mobile terminals. OSAT Company is using Agilent EMPro and the Momentum 3-D planar electromagnetic simulator to design and simulate innovative new antennas and circuits.

PVD handbook updated with cost and performance focus

02/28/2012 

The Handbook of Physical Vapor Deposition (PVD) Processing, Edition No. 2 has been released, covering all aspects of PVD process technology, from characterization and preparation of the substrate material, through deposition and film characterization, to post-deposition processing.

ISS Europe: Bridging the valley of death

02/27/2012 

A common theme among the presenters at SEMI's ISS Europe was how Europe might bridge the so-called “valley of death” between basic research and volume manufacturing.

Semiconductor makers ready for H2 2012 snapback

02/27/2012 

FBR Capital released its Q4 2011 semiconductor industry analysis, surveying chip, distributor, EMS, PC OEM, communications equipment OEM, handset OEM, and industrial firms. Their conclusion? Corrective actions in the supply chain have set up a possible H2 2012 snapback for semiconductors.

Intel 22nm 3D trigate transistors chosen for Tabula 3PLD products

02/24/2012 

Tabula is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3D tri-gate transistors and co-optimized packaging technology.

North American chip fab tool makers report 4th month of orders growth in January

02/24/2012 

North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.

SEMICON China: Challenges and opportunities for semiconductors, emerging techs

02/23/2012 

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.

Semiconductor metrology beyond 22nm: Defect inspection and review

02/23/2012 

As semis are manufactured at the 2X and 1Xnm nodes, new metrology technologies must evolve to fill the gaps. In Part 3 of this 3-part metrology series, SEMATECH discusses the inspection/metrology options for advanced semiconductors.

450mm wafers at SEMI ISS Europe

02/23/2012 

SEMI’s International Strategy Symposium (ISS) meets for its Europe session February 26-28 in Munich, Germany. Following are some of the 450mm wafer presentations scheduled to take place.

IBM, Samsung, GLOBALFOUNDRIES, ARM to keynote Common Platform Technology Forum

02/23/2012 

Simon Segars, ARM, will keynote the Common Platform Technology Forum, along with execs from IBM, Samsung and GLOBALFOUNDRIES, March 14 (Pi Day) in Santa Clara, CA.

AIXTRON deposition tools installed at graphene research lab in Italy

02/23/2012 

AIXTRON SE sold 2 BM Pro 4"-wafer deposition tools to the Italian Institute of Technology for the development and production of graphene used in novel hydrogen storage systems.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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