Semiconductors

SEMICONDUCTORS ARTICLES



Diamond films no longer in the rough with AKHAN Technologies launch

11/28/2011 

AKHAN Technologies has developed a shallow n-type diamond material over silicon that has characteristics such as a shallow ionization energy, high carrier mobility, and no graphitic phases. Adam Khan, president of AKHAN Technologies, says that the bottleneck in development of diamond films has always been the fabrication of n-type diamond.

Elpida, Nanya lob patent accusations amid DRAM quagmire

11/28/2011 

With losses and oversupplies mounting, DRAM rivals are taking increasingly drastic steps to stay competitive, including courtroom battles and even more production cutbacks.

SUSS MicroTec partners for health research

11/25/2011 

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).

MENT, JEOL optimize multi-resolution IC mask writing process

11/24/2011 

Mentor Graphics and JEOL will collaborate on multi-resolution mask writing for shot count reduction of up to 30% compared to the conventional writing technique for IC lithography masks.

NeoPhotonics doubles PIC production capacity

11/23/2011 

Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.

DAC seeks speakers bureau experts

11/23/2011 

The Design Automation Conference (DAC) is soliciting semiconductor industry experts for participation in invited sessions, panels, and other events at the 49th DAC, June 3-7, 2012 in San Francisco, CA.

ICPT 2011: Familiar CMP themes expand to new apps, interactions

11/22/2011 

Paul Feeney, director of process technology at Axus and ITRS co-leader for planarization topics, reports from the International Conference on Planarization/CMP Technology in Korea. Technical themes continue to address main areas (STI, ULK) but also explore new applications (e.g. TSVs), non-uniformity, and interaction between all the CMP process components.

Plan for 450mm whether an early adopter or not

11/21/2011 

Even if you don't plan on being a 450mm wafer size early adopter, should your planned upgrades handle the layout, utilities, vibration, and cleanroom criteria suitable for a 450mm semiconductor manufacturing environment? Yes, says Terry Behrens, or else be prepared to pay more.

Amazon Kindle Fire puts Ilitek on the map

11/21/2011 

In an IHS iSuppli Teardown Analysis, IHS found that Amazon is using previously unknown Jorjin and Ilitek for its WLAN module and touchscreen controller IC, respectively, in the new Kindle Fire media tablet. Other teardown findings? TI is all over the new product, and a Kindle Fire costs more than its price.

IHS downgrades semiconductor forecast within positive territory

11/21/2011 

IHS has reduced its global semiconductor market forecast for 2011 to 1.2% growth, a slight revenue increase over 2010 owing to continued growth in the third quarter. This is down from the 2.9% growth IHS forecast when it looked at the numbers in September.

MEMS win, DRAM lose in ultrabook designs

11/18/2011 

Sensors are hot items for ultrabook functionalities, boosting MEMS sales. The thin form factor of ultrabooks will deter DRAM device integration and DRAM use as memory upgrades, according to IHS iSuppli Semiconductor Value Chain.

Carl Zeiss combines light and electron microscopy divisions

11/18/2011 

Citing a change in the microscope customer market over the past decade, Carl Zeiss launchEd Carl Zeiss Microscopy. 2,500 employees of MicroImaging und Nano Technology Systems now form the new business group in the Carl Zeiss Group.

Intermolecular (IMI) prices IPO

11/18/2011 

Intermolecular Inc. (Nasdaq:IMI) priced its initial public offering of 9,650,000 shares of common stock at a public offering price of $10.00 per share.

Semiconductor yield improvement with scan diagnosis

11/18/2011 

ICs manufactured at 65nm nodes and smaller introduce new design-specific and feature-sensitive failure mechanisms, with systematic yield issues even more challenging to diagnose and overcome. SMIC and Mentor Graphics cover how to use scan diagnosis for better semiconductor yields.

Fabless semiconductor start-ups gain Singapore association support

11/17/2011 

Semiconductor start-ups are forming at a slower pace in recent years, and VCs are less willing to invest. In light of this environment, Singapore Semiconductor Industry Association announced 3 initiatives to support emerging fabless semiconductor companies.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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